Industry News: underfil (Page 17 of 41)

Loctite Receives Quality Improvement Award

Industry News | 2002-03-13 07:31:38.0

Loctite Corp. has been named a recipient of Intel Corp.'s (Chandler, AZ) 2001 Supplier Continuous Quality Improvement (SCQI) award for outstanding commitment to quality and performance by suppliers providing products and services deemed essential to Intel's success. The company was recognized for its efforts in supplying Intel with die attach adhesives and underfill materials. All SCQI award winners will be honored at a celebration in Burlingame, CA on March 13, 2002.

Henkel Electronic Materials

Dispenser Bound for Chinese Technology Centre

Industry News | 2003-05-29 08:13:34.0

Universal Instruments and Asymtek have formed a partnership that will place an Asymtek Millennium 2020 dispenser in Universal's new Technology Excellence Centre in Suzhou, China.

Universal Instruments Corporation

Indium�s Dr. Lee and Dr. Lasky to Present at APEX

Industry News | 2005-01-11 11:17:37.0

Indium Corporation�s VP of Technology, Ning-Cheng Lee, Ph.D and Senior Technologist, Ronald C. Lasky, Ph.D., PE, will both be presenting courses on Pb-Free electronic assembly at APEX in Anaheim, CA in February.

Indium Corporation

Indium Corporation to Feature WEEE/RoHS Compliant Materials at Productronica

Industry News | 2005-10-20 11:39:06.0

Indium Corporation will be exhibiting its Suite of Pb-Free Electronics Assembly Materials for WEEE and RoHS compliance at the Productronica show in Munich, Germany on November 15-18, 2006.

Indium Corporation

Reliability the Focus of Indium Corporation at Nepcon East/Electro

Industry News | 2006-04-20 12:26:41.0

Indium Corporation will highlight its Reliability Program at their exhibit at Nepcon East/Electro, May 10-11, 2006 in Boston, MA. Indium�s team of experts will be available at booth #3017 to answer questions and provide information.

Indium Corporation

Indium Corporation�s Dr. Ning-Cheng Lee and Dr. Ronald Lasky to Present at Lead-Free Workshop

Industry News | 2006-09-28 13:40:04.0

Indium Corporation�s Vice President of Technology, Ning-Cheng Lee, Ph.D., and Senior Technologist, Ronald C. Lasky, Ph.D., PE, will present at Implementing Lead-free: A Hands-on Workshop, October 16-19, 2006 at the Rochester Institute of Technology (RIT) Campus in Rochester, NY USA.

Indium Corporation

Indium Corporation Wins 2007 Innovation Award

Industry News | 2007-05-02 12:18:23.0

Indium Corporation�s Indium5.1AT Pb-Free Solder Paste was awarded the Innovation Award at Nepcon China in Shanghai, China.

Indium Corporation

Solder Joint Encapsulant for Ball Bumping Applications: BP 256

Industry News | 2014-09-22 10:40:15.0

YINCAE Advanced Materials, LLC is pleased to announce the release and availability of BP 256. It is a part of the innovative SMT 256/266 series, solder joint encapsulant.

YINCAE Advanced Materials, LLC.

Metcal Wins SMT China Vision Award for the APR-2000-SCS Scarab Site Cleaning System

Industry News | 2015-04-21 16:39:45.0

Metcal is pleased to announce that it was awarded a 2015 SMT China Vision Award in the category of Repair & Rework for its APR-2000-SCS Scarab Site Cleaning System. The award was presented to the company during an April 21, 2015 ceremony at the Shanghai World Expo Exhibition & Convention Center during NEPCON China.

Metcal


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