Industry News | 2013-05-01 20:51:31.0
Metcal today announced an additional date for its 2013 Spring series of BGA rework and repair seminars, this time co-hosting with Nikon and Nordson ASYMTEK.
Industry News | 2014-04-10 10:17:27.0
AI Technology has just increased its manufacturing capacity to more than 10 million square feet of its 10 micron thick ESP7660 series of insulating DAF for memory stacked chip applications and its 20 micron thick ESP8660 series of conductive DAF for power devices.
Industry News | 2014-05-07 16:11:10.0
AI Technology (AIT) Releases Electrically and Thermally Conductive 20 Micron Wafer Level Die-Attach Film (DAF), Combines High Glass Transition Temperature and Stress Absorption with Proven Thermal Performance in Die-Attach Power Dissipation.
Industry News | 2018-02-28 08:22:00.0
Essemtec has been awarded a 2018 NPI Award in the category of Dispensing for its Tarantula – Relentless All Terrain Jet Dispenser. The system features state-of-the-art technology and can be easily integrated in any line. It is designed for a wide range of dispensing applications such as solder paste and SMT glue, LED encapsulation, silver epoxy, dam and fill, underfill, cavity fill, 3D dispensing via laser height mapping and more.
Industry News | 2019-07-15 14:35:27.0
(Albany, NY) July 15, 2019 YINCAE Advanced Materials is proud to announce that we will be exhibiting at this year’s IMAPS 2019 Boston 52nd International Symposium on Microelectronics, at the Hynes Convention Center, in Boston, MA on October 1 - 2, 2019.
Industry News | 2019-10-17 15:18:56.0
PVA today announced that it will be running live dispensing demos in Hall A2, Booth #253 at productronica, scheduled to take place Nov. 12-15, 2019 at the Neue Messe München in Munich, Germany. Demos will be available for the following equipment: Delta 8 with MR2, Delta 8 featuring a PCS150 & PC150 fed by a VPK-2K for 2K coating, Delta 8 equipped with a FCS300-ES, SJ100 & FC100-CF for film coating, and Delta 6 configured for PCB assembly (surface mount adhesive, underfill, encapsulation, etc.).
Industry News | 2020-06-11 06:23:00.0
Essemtec announces that its Spider smart-sized high-speed dispenser can be adapted for a wide range of dispensing applications including solder paste and SMT glue, LED encapsulation, silver epoxy, dam and fill, underfill, cavity fill, 3D dispensing via laser height mapping and more.
Industry News | 2004-09-02 22:58:52.0
Indium Corporation of America will be exhibiting at Assembly Technology Expo (booth # 5631)
Industry News | 2004-09-09 12:55:33.0
Implementing Lead-free Assembly at Your Facility
winsouce.jpg)
.gif)