Industry News | 2003-04-15 08:57:18.0
First Implementation of the Package Platform Delivers 50-percent Cost, 60-percent Height, and 75-percent Area Reductions over Conventional RF Module Technologies
Industry News | 2002-04-12 08:40:35.0
To Organize and Coordinate Roadmapping, Standardization, Legislative, Market Research, and Education Efforts Within the Photonics Industry
Industry News | 2003-05-14 08:00:59.0
On Wednesday, April 20, electronics manufacturers, industry experts, and Universal personnel met in Orlando, Florida, USA, for a day of information sharing on a wide range of topics.
Industry News | 2018-12-21 06:39:01.0
Indium Corporation’s Andy Mackie, PhD, MSc, Senior Product Manager, Semiconductor and Advanced Assembly Materials, will share his expertise at a TechSearch International’s workshop on Packaging for Automotive Electronics: Meeting Reliability Challenges for ADAS and Electronic Vehicles, Feb. 12-13, 2019, in Austin, Texas.
Industry News | 2001-01-17 10:47:04.0
Valor Computerized Systems today announced powerful new functionality in release 6.0 of its Trilogy 5000 CAM software for virtual prototyping and assembly and test. This major release contains a number of significant new CAM productivity tools that strengthen Trilogy 5000's position as the best-in-class CAM system for global electronics manufacturing services (EMS) companies.
Industry News | 2014-03-12 14:46:33.0
MIIT issued 4G licenses to China Mobile, China Telecom, and China Unicom on 4 Dec, marking the beginning of the 4G era in China.
Industry News | 2019-12-16 22:42:05.0
T1 is a multi-function placement machine, also a submicron flip eutectic placement machine, providing placement accuracy up to 5 microns, suitable for all kinds of flip chip, common chip mounting, can handle the minimum chip spacing as low as 50 microns.
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