Industry News: universal instruments fiducial camera (Page 1 of 2)

MIRTEC Announces Technical Collaboration with Universal Instruments’ Advanced Process Lab

Industry News | 2019-10-21 16:37:01.0

MIRTEC is pleased to announce that it has installed one of its Award-Winning MV-6 OMNI 3D AOI Systems at Universal Instruments’ Advanced Process Lab (APL) in Conklin, New York. Universal’s APL offers comprehensive research, analytical and advanced assembly services that enable manufacturers to realize rapid product introduction, maximize yield and optimize reliability.

MIRTEC Corp

A Look to the Future in the Electronics Industry at IPC APEX EXPO® 2013

Industry News | 2013-01-19 07:46:16.0

Information that inspires innovation is center-stage for design, printed boards, electronics assembly, test and printed electronics

Association Connecting Electronics Industries (IPC)

Universal’s GenesisSC: Semiconductor Performance at Surface Mount Speeds

Industry News | 2010-04-12 01:51:10.0

Universal Instruments expands its proven Genesis Platform portfolio with the introduction of the GenesisSC Platform – a revolutionary Semiconductor solution that blends state-of-the-art flip chip assembly capabilities with the robustness and speed of the Genesis Platform.

Universal Instruments Corporation

Valor and Universal Streamline Shop-Floor and Enterprise-Level Dialogue

Industry News | 2003-06-13 10:23:02.0

Universal Instruments and Valor Computerized Systems have announced an agreement to interface Valor software products with Universal's manufacturing systems

Universal Instruments Corporation

Silicon Mountain's Annual Multi-Million Placement Accuracy Statistics for First Pass Yield Continue to Grow

Industry News | 2023-04-11 09:40:15.0

Silicon Mountain announced that its annual multi-million placement accuracy statistics for first pass yield continue to grow. The company uses surface mount technology (SMT) machines, including the award-winning Fuzion and Advantis Platforms from Universal Instruments. These machines offer the latest, innovative technology in SMT. They enable Silicon Mountain to print, place, and reflow components in a variety of sizes from

Silicon Mountain Contract Services, LP

Nordson DAGE Awarded a EM Asia Innovation Award for Camera Assist Automatic Bondtesting on the 4000Plus

Industry News | 2015-04-22 14:52:28.0

Nordson DAGE, a division of Nordson Corporation (NASDAQ: NDSN), announces that it has been awarded a 2015 EM Asia Innovation Award in the category of Test Instruments for Camera Assist Automatic Bondtesting on the 4000Plus. The award was presented to the company during an April 22, 2015 ceremony at the Shanghai World Expo Exhibition & Convention Center during NEPCON China. This is the fourth award for this application.

Nordson DAGE

Wavelength Electronics Purchases Hentec/RPS Vector 460 Selective Soldering System

Industry News | 2021-06-28 12:37:41.0

Vector 460 offers unmatched thermal capability, rapid programming, and simplistic elegance in operation.

Hentec Industries, Inc. (RPS Automation)

Universal Releases Placement Platform for Small, Mid-Size Manufacturers

Industry News | 2003-03-10 09:36:24.0

The machine has been streamlined by removing many features required by larger manufacturers.

Universal Instruments Corporation

Pantera X-plus – Essemtec’s Proven Pick-and-Place System for Small Batches

Industry News | 2014-04-24 03:37:36.0

With more than 1500 installations worldwide, the Pantera X pick-and-place system from Essemtec offers new benefits for highly flexible small batch assembly. The field-proven machine was further developed and supplemented in order to better cover the ever-increasing demands for future component accuracy and diversity.

ESSEMTEC AG

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