Industry News | 2024-03-18 13:13:32.0
Silicon Mountain is thrilled to announce the recent acquisition of the Universal Instruments Fuzion system. This strategic move is set to significantly enhance the company's manufacturing capabilities, thereby providing substantial benefits to both the company and its diverse range of customers.
Industry News | 2017-04-10 13:16:16.0
ADLINK Technology is pleased to introduce the cPCI-6630 6U CompactPCI, the world's first CompactPCI blade with the 6th generation Intel® Core™ i7 processor in a 6U form factor on the embedded market. ADLINK's latest addition to its value line of processor blades also features support for legacy IO, including VGA, PMC, CompactFlash, USB 2.0 and PS/2 keyboard/mouse; and support for QNX 6.5/6.6 and Linux legacy OSes for easy integration. The cPCI-6630 is ideal for factory and industrial automation or security communication systems that need cost-efficient performance.
Industry News | 2010-04-12 01:51:10.0
Universal Instruments expands its proven Genesis Platform portfolio with the introduction of the GenesisSC Platform – a revolutionary Semiconductor solution that blends state-of-the-art flip chip assembly capabilities with the robustness and speed of the Genesis Platform.
Industry News | 2003-09-03 11:07:19.0
New AN221E02 Features Full Dynamic Reconfiguration Features, Opens Simple Analog Applications to Platform-Based Solution
Industry News | 2011-09-12 15:45:51.0
JTAG Technologies is pleased to announce the immediate release of a new JTAG/boundary-scan hardware interface product compatible with the MAC-Panel ‘Scout’ mass interconnect system. The JT 2147/DAK is a signal conditioning module that allows seamless connections from JTAG Technologies PXI DataBlaster to the Scout’s connection system.
Industry News | 2013-07-18 20:34:15.0
ADLINK Technology announces the release of its new four-channel USB 2.0 dynamic signal acquisition module, the USB-2405.
Industry News | 2016-02-02 12:18:54.0
Gen3 Systems Limited is pleased to announce that it will exhibit in Booth E19 at Southern Manufacturing, scheduled to take place Feb. 9-11, 2016 at FIVE in Farnborough, Hampshire.
Industry News | 2010-07-29 15:10:06.0
Universal Instruments’ Advanced Process Lab hosted the first Advanced Research in Electronics Assembly (AREA) Consortium meeting of 2010 at the Treadway Inn in Owego, NY on June 16-17. Nearly 80 attendees from the 29 member companies participated in the two-day event, which will also be presented in subsequent webcasts. Topics ranged from thermal interface assembly to a continuing analysis of lead-free solder microstructure and reliability.
Industry News | 2013-05-15 19:28:54.0
ADLINK Technology announced new leadership for its global business unit with the addition of Dirk Finstel as Executive Vice President of MCPS and CEO of ADLINK's European headquarters, Lippert ADLINK Technology GmbH in Mannheim, Germany.
Industry News | 2016-06-15 19:41:50.0
BTU International has renewed its membership in the Advanced Research in Electronics Assembly (AREA) Consortium, established by Universal Instruments’ Advanced Process Laboratory (APL). The state-of-the-art APL currently houses a PYRAMAX™ 100N Reflow Oven with 400°C capability and will soon accept delivery of a PYRAMAX™ 125N Reflow Oven. The 125N features a 24" width process chamber enabling the processing of large boards for LED and other applications.
