Industry News | 2016-06-21 15:27:05.0
JTAG Technologies – a specialist in board (PCBA) test solutions based on JTAG and IEEE 1149.x standards announce a new family of hardware adapters specifically designed for testing of a variety of DIMM & SODIMM sockets (sizes and styles) using a JTAG/boundary-scan controller and supporting software.
Tecnomatix Unicam, Inc
Industry News | 2015-06-26 02:00:46.0
A UK electronic assembly specialist is celebrating its 15th anniversary in style, by posting record sales and signing off on a £350,000 investment.
Industry News | 2010-04-12 17:20:44.0
Universal Instruments has bolstered its Dimensions line software suite with the introduction of Linechart™ – a performance-monitoring software module designed to increase utilization rates to over 90%. This new multi-vendor reporting software provides complete visibility into all production lines and quickly identifies factory inefficiencies.
Industry News | 2001-01-29 14:45:47.0
Addressing the electronics industry's need for a cost-effective odd form placement and final assembly workcell, Universal Instruments Corp. has launched the new Polaris Assembly Cell.
Industry News | 2012-08-29 10:27:05.0
Pennsylvania State University was selected in a university donation drawing for a FINEPLACER® Pico MA bonder on August 15, 2012.
Industry News | 2011-06-22 00:38:04.0
Universal Instruments announces an unprecedented upgrade path for its customers to enhance the performance of their surface mount platform feeders. The offer features two distinct options for improving feeder functionality to maximize machine and production line efficiency: a Gold Feeder Remanufacture Program, and a “Green-for-Gold Plus” Feeder Recycle Program.
Industry News | 2018-02-06 20:49:31.0
Universal Instruments will feature flexible surface mount, odd-form and automation platform solutions at the 2017 IPC APEX EXPO held at the San Diego Convention Center on February 27 – March 1. On booth 3141, Universal will demonstrate its FuzionOF™ high-speed automation platform, extra-capacity FuzionXC2-37™ Platform and Uflex™ modular automation platform.
Industry News | 2012-02-07 16:16:09.0
Finetech will donate a high-accuracy die bonder in a drawing this summer that is open to U.S. and Canadian qualified universities and colleges. The multi-application FINEPLACER® Pico MA bonder with 5 micron placement accuracy is valued at $100,000.
Industry News | 2014-09-23 18:36:35.0
Kurtz Ersa North America announcing that the i-CON VARIO 2 Multi-Channel Soldering and De-Soldering Station is the universal power pack of the Ersa i-CON family
