Industry News | 2013-08-07 12:37:57.0
PCB design skills will be put to the test at IPC’s PCB Design Contest, scheduled to take place 26 August 2013 at the NIMHANS Convention Centre in Bangalore, India as part of IPC APEX India™.
Industry News | 2013-09-24 14:34:40.0
In the cool November weather in Munich, IPC’s Hand Soldering Competition is sure to heat things up at productronica 2013, stand A3.415.
Industry News | 2013-01-19 07:46:16.0
Information that inspires innovation is center-stage for design, printed boards, electronics assembly, test and printed electronics
Industry News | 2023-10-30 06:11:57.0
When it comes to selecting an automatic PCB separator, the decision can be pivotal for your manufacturing process. We understand that precision, operational mode, speed, and cost-effectiveness are significant factors in this choice. In this comparison, we'll explore the differences between two of our outstanding products, the I.C.T-5700 and the I.C.T-IR350, to help you make an informed decision.
Industry News | 2009-06-11 12:25:44.0
Company Expands Training Services
Industry News | 2004-09-22 20:15:15.0
IPC and HKPCA�s premier industry event, International Printed Circuit and Electronics Assembly Fair will be held in Dongguan, China from December 8-10, 2004
Industry News | 2012-08-29 17:24:18.0
The Northeast is about to get a whole lot hotter as competitors fire up their soldering irons at the first Northeast Regional Solder Skills Competition on September 18, 2012, in Boxborough, Mass
Industry News | 2003-02-10 13:40:31.0
Will Provide Participants Immediate Access to a Network of Government and Industry Contacts in China
Industry News | 2008-04-21 14:58:41.0
Minneapolis**, MN�* An Evolving Technologies Summit is scheduled during the SMTA�s annual conference, SMTA International, at the Disney's Coronado Springs Resort and Convention Center, Orlando, FL, from August 17-21, 2008.
Industry News | 2010-05-30 23:23:13.0
Minneapolis, MN - The Surface Mount Technology Association (SMTA) announces the Call for Papers for the 2011 Pan Pacific Microelectronics Symposium, which will be held January 18-20, 2011 on the Big Island of Hawaii. The symposium focuses on the critical business markets and technologies of microelectronic packaging, interconnection, microsystems technology and assembly. The deadline for abstracts is July 16, 2010.
