Industry News: up 500 (Page 18 of 72)

BTU Wins 2008 EM Asia Innovation Award for Its

Industry News | 2008-04-10 13:53:26.0

NORTH BILLERICA, Mass., April 10, 2008 � BTU International, Inc. (Nasdaq: BTUI), a leading supplier of advanced thermal processing equipment for the alternative energy and electronics manufacturing markets, has been awarded an EM Asia Innovation Award in the category of Environmentally Friendly/Alternative Energy Production Equipment for its In-Line Diffusion System. The award was presented to the company during Nepcon China 2008.

BTU International

BTU Wins 2008 Global Technology Award for Its In-Line Diffusion System

Industry News | 2008-09-10 00:48:15.0

NORTH BILLERICA, Mass., September 2008 � BTU International, Inc. (Nasdaq: BTUI), a leading supplier of advanced thermal processing equipment for the alternative energy and electronics manufacturing markets, has been awarded a 2008 Global Technology Award in the Environmentally Friendly category for its In-Line Diffusion System. The award was presented to the company during SMTA International 2008 in Orlando, FL.

BTU International

Seika Machinery to Debut Sayaka SAM-CT23W at SMTA International

Industry News | 2013-09-23 08:02:40.0

Seika Machinery, Inc. announces that it will debut the Sayaka SAM-CT23W in Booth #409 at the upcoming SMTA International Exhibition, scheduled to take place October 15-16, 2013 at the Fort Worth Convention Center in Texas.

Seika Machinery, Inc.

Hyundai Mobis Invests in CyberOptics’ SE500™ SPI System

Industry News | 2010-11-15 22:18:42.0

CyberOptics announces that Hyundai Mobis has invested in the SE500™ 100 percent 3-D solder paste inspection system for its Tianjin plant. Hyundai Mobis' investment totals approximately US$500K.

CyberOptics Corporation

Seika Machinery to Debut RD-500V All-In-One Rework Station at SMTAI

Industry News | 2014-08-26 16:30:01.0

Seika Machinery, Inc. will debut the RD-500V Rework Station from DEN-ON INSTRUMENTS CO., LTD. in Booth #835 at SMTA International, scheduled to take place Sep. 30 - Oct. 1, 2014 at the Donald Stephens Convention Center in Rosemont, IL.

Seika Machinery, Inc.

Heraeus Electronics Introduces Optimized Copper Ribbon for Laser Bonding at PCIM Europe

Industry News | 2022-05-18 13:01:33.0

Heraeus Electronics today announced the launch of its new PowerCu Soft Laser Ribbons (LRB) for Laser Bonding during PCIM Europe in Nuremburg. This innovative optimized copper ribbon is proven to effectively achieve more efficiency and stability in power electronic systems. It enables module operation temperatures higher than 250°C and allows the highest power density designs.

Heraeus

Nordson DAGE and Nordson YESTECH to Display Market Leading AOI, Bond Test and X-ray Inspection Systems at NEPCON South China

Industry News | 2014-07-30 12:10:12.0

Nordson DAGE and Nordson YESTECH, divisions of Nordson Corporation (NASDAQ: NDSN), announce they will exhibit in Booth # A-1H30 at NEPCON South China, scheduled to take place August 26-28, 2014 at the Shenzhen Convention & Exhibition Center in Shenzhen, China.

Nordson DAGE

MYDATA Synergy Line at Productronica 2007

Industry News | 2007-11-05 12:19:25.0

With two MY12 machines and one MY500 operating in a fully automated line, visitors to Productronica will witness how MYDATA eliminate lead times between production runs � without any operator involvement.

Mycronic Technologies AB

Essemtec to Debut Smart Solution Concept and 3D MID Production Line at Productronica

Industry News | 2013-10-08 16:27:28.0

Essemtec, the Swiss manufacturer of production systems for electronic assembly and packaging, will highlight its newest machines in Hall A3, Stand 341 at the 20th international productronica international trade fair, scheduled to take place November 12 - 15, 2013 at the New Munich Trade Fair Centre in Munich, Germany.

ESSEMTEC AG

Cyberoptics to Unveil Latest AOI and Solder Paste Inspection Platforms at Productronica

Industry News | 2009-12-07 18:06:10.0

CyberOptics Limited will demonstrate the most comprehensive inspection platform at Productronica. The exhibition will see them unveil the brand new QX500 AOI system alongside the newly launched SE500 and SE500-X 3-D Solder Paste Inspection Systems and the latest innovation in Flex HR AOI software. Visitors are invited to join Cyberoptics in Hall A2, Stand 417 for the ‘complete’ inspection experience, scheduled to take place 10th – 13th November 2009 at the New Munich Trade Fair Center in Munich, Germany.

CyberOptics Corporation


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