Industry News: upside down ic chips (Page 1 of 5)

IPC Urges U.S. Senate and House to Complete R&D Legislation Before August Recess

Industry News | 2022-07-25 08:18:26.0

IPC is encouraging the U.S. Senate and House to complete action on slimmed-down R&D legislation, following a Senate vote clearing the way for a vote in the coming days.

Association Connecting Electronics Industries (IPC)

‘Origins of Silicon Valley’ Is Keynote Topic of International Wafer-Level Packaging Conference (IWLPC)

Industry News | 2013-06-20 19:16:54.0

SMTA and Chip Scale Review magazine are pleased to announce the keynote presentation for the 10th Anniversary of the International Wafer-Level Packaging Conference, November 5-7, 2013 in San Jose, CA.

Surface Mount Technology Association (SMTA)

Bonding Flip Chips on to Flexible Circuit Boards

Industry News | 2011-01-18 13:46:21.0

Time and again, a major challenge lies in attaching integrated circuits (ICs) to highly integrated circuit board substrates in a space-saving manner. Würth Elektronik took this challenge on and found an ideal solution with the ESC (encapsulated solder connection) process. The chips are soldered and at the same time glued 'face-down" in their exact position.

Würth Elektronik GmbH & Co. KG

ESSEMTEC to Display EXPERT-SAFP Prototyping Station at APEX 2008

Industry News | 2008-03-20 16:10:40.0

Essemtec will showcase EXPERT-SAFP universal prototyping station in booth 501 at the upcoming APEX 2008 exhibition and conference, scheduled to take place April 1-3, 2008, in Las Vegas.

ESSEMTEC AG

ESSEMTEC to Feature EXPERT-SAFP Prototyping Station at SMTA International 2008

Industry News | 2008-08-07 11:52:44.0

Essemtec will display EXPERT-SAFP universal prototyping station in booth 211 at the upcoming SMTA International 2008 exhibition and conference, scheduled to take place August 19-20, 2008, in Orlando, FL.

ESSEMTEC AG

ESSEMTEC to Feature EXPERT-SAFP Prototyping Station at IPC Midwest 2008

Industry News | 2008-09-12 03:27:20.0

Essemtec will display EXPERT-SAFP universal prototyping station in booth 907 at the upcoming IPC Midwest exhibition & conference, scheduled to take place September 24-25, 2008 in Schaumburg, IL.

ESSEMTEC AG

ESSEMTEC to Highlight EXPERT-SAFP Prototyping Station at APEX 2009

Industry News | 2009-03-19 15:08:37.0

Essemtec will feature EXPERT-SAFP universal prototyping station in booth 243 at the upcoming APEX 2009 exhibition and conference, scheduled to take place March 31-April 2, 2009, in Las Vegas.

ESSEMTEC AG

StarChip Announces the Sampling of the SCF335H, its New Generation of SIM Controllers

Industry News | 2012-04-26 06:47:41.0

New generation of SIM controllers is designed to cover demands of USIM Java CardTM applications, with the SCF335H being the first product of a new family that will fully encompass the Telecom Smart Card ICs market

Starchip

StarChip is Sampling the SCF335H, its New Generation of SIM

Industry News | 2012-04-26 07:12:36.0

New generation of SIM controllers is designed to cover demands of USIM Java CardTM applications, with the SCF335H being the first product of a new family that will fully encompass the Telecom Smart Card ICs market

Starchip

Essemtec Introduces Semiautomatic SMT Prototyping System at NEPCON China 2008

Industry News | 2008-04-07 19:18:42.0

Essemtec announces it will introduce the Semiautomatic SMT Prototyping System, EXPERT in distributor -------- booth ------ at the upcoming NEPCON China/EMT China 2008 exhibition and conference - scheduled to take place April 8-11, 2008 in Shanghai, PR China.

ESSEMTEC AG

  1 2 3 4 5 Next

upside down ic chips searches for Companies, Equipment, Machines, Suppliers & Information

Voidless Reflow Soldering

High Precision Fluid Dispensers
Solder Paste Dispensing

Best Reflow Oven
SMT feeders

World's Best Reflow Oven Customizable for Unique Applications