Industry News: uv curables (Page 1 of 3)

GPD Global's PCD4 Dispense Pump Now Is Available in Europe and Asia/Pacific

Industry News | 2012-04-06 15:32:39.0

GPD Global, a manufacturer of precision fluid dispensing systems for high-volume 24/7, low-volume/high-mix and R&D production, announces the global release of its PCD4 Dispense Pump after its successful release and testing in the North American market.

GPD Global

Revive Your Dispenser with Advanced Dispense Technologies

Industry News | 2016-12-09 23:33:42.0

GPD Global offers advanced dispense pump technologies to upgrade your existing platform and take advantage of existing capital equipment. Retrofit your system with innovative dispensing technology for excellent dispense control and repeatability.

GPD Global

RBC Introduces Newly Developed UV Curable Adhesive Ideal for Bonding Ferrite Cores.

Industry News | 2003-06-06 08:17:43.0

This revolutionary adhesive provides instant cure, superior bond strength and will significantly reduce in-process inventory and increase productivity.

RBC Industries, Inc

Christopher Associates Introduces New Edge Coating System for LED Panels

Industry News | 2011-12-06 18:09:01.0

Christopher Associates introduces Shoda Techtron’s UVP-630A Edge Coating System for LED substrates.

Christopher Associates Inc.

What are the USES of UVLE curing machine and UVLED vacuum oven?

Industry News | 2019-12-16 22:07:54.0

UVLED curing machine is generally used for UV glue, UV ink and other UV coating curing, can achieve the purpose of rapid deep curing, the principle is UV irradiation special glue causes glue to produce polymerization reaction to cure.

Beijing Technology Company

Reworkable Underfill Encapsulant for CSP's and BGA's

Industry News | 2003-09-25 13:32:47.0

Reduce waste and cost.

Zymet, Inc

Reworkable Underfill Encapsulant for BGA's

Industry News | 2004-04-27 15:19:57.0

Zymet has introduced a new reworkable underfill encapsulant, CN-1453, designed for BGA encapsulation. Removal of defective BGA's is easily accomplished by heating the component and the underfill encapsulant to 220°C. Underfill encapsulant residues are easily scraped or brushed off.

Zymet, Inc

MARTIN Appoints Sales Manager for U.S., Canada and Mexico

Industry News | 2010-03-08 17:13:54.0

MARTIN, a FINETECH company, has appointed Scott Rushia as Sales Manager for the U.S., Canada and Mexico. In his new role, Rushia is responsible for sales and service for Martin’s rework and dispensing products.

Finetech

Reworkable Edgebond Adhesive Improves CBGA and BGA Thermal Cycle Performance and Eliminates Underfill

Industry News | 2011-04-07 20:23:54.0

Zymet Inc. has introduced a reworkable edgebond adhesive, UA-2605, that improves thermal cycle performance of CBGAs and plastic BGAs. In one trial, UA-2605 tripled the 0°C to +100°C performance of a CBGA, to nearly 2500 cycles. Previously, an underfill was needed to achieve this level of performance.

Zymet, Inc

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