Industry News: uv rubbing off (Page 2 of 6)

Reworkable Underfill Encapsulant for BGA's

Industry News | 2004-04-27 15:19:57.0

Zymet has introduced a new reworkable underfill encapsulant, CN-1453, designed for BGA encapsulation. Removal of defective BGA's is easily accomplished by heating the component and the underfill encapsulant to 220°C. Underfill encapsulant residues are easily scraped or brushed off.

Zymet, Inc

Nordson DAGE and Nordson YESTECH to Display Market Leading AOI, Bond Test and X-ray Inspection Systems at NEPCON South China

Industry News | 2014-07-30 12:10:12.0

Nordson DAGE and Nordson YESTECH, divisions of Nordson Corporation (NASDAQ: NDSN), announce they will exhibit in Booth # A-1H30 at NEPCON South China, scheduled to take place August 26-28, 2014 at the Shenzhen Convention & Exhibition Center in Shenzhen, China.

Nordson DAGE

Nordson TEST & INSPECTION Will Exhibit with SMarTsol Technologies at SMTA Guadalajara

Industry News | 2022-08-26 09:23:24.0

Nordson TEST & INSPECTION, a division of the Nordson Corporation (Nasdaq: NDSN), will exhibit at the SMTA Guadalajara Expo & Tech Forum, scheduled to take place Sept. 21-22, 2022, at the Expo Guadalajara in Jalisco, Mexico. The Assure™ Pro, Quadra 7, FX-940UV and FX-942 will be on display in the SMarTsol Technologies booth.

Nordson Corporation

Techcon Systems Develops First-to-Market Disposable Material Path Diaphragm Valve

Industry News | 2015-08-25 11:15:00.0

Techcon Systems has developed a new disposable material path (DMP) diaphragm valve. The new TS5624DMP valve features a “first to market” disposable material path, enabling difficult fluids and pre-mixed two-part epoxies to be dispensed without the need for frequent cleaning. The entire wetted area can simply be replaced in a matter of seconds, while the valve stays on the production line.

Techcon Systems

Nordson YESTECH to Showcase Its Market-Leading AOI and AXI Inspection Systems at IPC APEX 2014

Industry News | 2014-02-26 14:17:03.0

Nordson YESTECH will feature its market leading Automated Optical (AOI) and Automated X-ray Inspection (AXI) systems in Booth #2025 at the upcoming IPC APEX EXPO.

Nordson YESTECH

Nordson to Showcase Market-Leading Test and Inspection Systems at NEPCON South China

Industry News | 2016-07-30 19:34:22.0

Nordson DAGE and Nordson MATRIX, divisions of Nordson Corporation (NASDAQ: NDSN), will exhibit in Stand 1H20 at NEPCON South China, scheduled to take place Aug. 30-Sept. 1, 2016 at the Shenzhen Convention & Exhibition Centre. Nordson DAGE will showcase its new 4th generation, ultra-high resolution, off-line MXI X-ray system – the Quadra™ 7 and 4000Plus Bondtester. Nordson MATRIX will showcase its high-speed X3 Inline AXI system.

Nordson DAGE

Nordson YESTECH to Demonstrate Automated In-line PCB Inspection at Productronica

Industry News | 2013-10-25 17:55:58.0

Nordson YESTECH,a subsidiary of Nordson Corporation (Nasdaq: NDSN) will feature the FX SL AOI in Hall A2, Stand 438 at the Productronica International Trade Fair, scheduled to take place November 12 - 15, 2013 at the New Munich Trade Fair Centre in Munich, Germany.

Nordson DAGE

Cupio Yestech Europe demonstrates conformal coating inspection at NEW

Industry News | 2014-05-06 11:52:11.0

Visitors to the recent National Electronics Week (NEW) exhibition and conference in Birmingham had a unique opportunity to learn about the advantages of conformal coating, which many electronics manufacturers increasingly view as an integral part of their production process. Exhibits including a live production line, and a seminar, revealed how to achieve as much as possible from the technology and how to fully understand the issues involved.

Cupio Yestech Europe

New Technomelt® Material Streamlines Substrate Coating Processes

Industry News | 2016-03-27 14:19:07.0

Henkel Adhesive Technologies’ award-winning Technomelt® materials have long been recognized as the industry standard for high-performance low pressure molding applications. Extending the effectiveness of the portfolio outside of proven encapsulation processes, a newly-formulated Technomelt is now also providing a streamlined and economical alternative to conventional masking techniques for various coating requirements.

Henkel Electronic Materials

Reworkable Underfill Encapsulant for CSP's and BGA's

Industry News | 2003-09-25 13:32:47.0

Reduce waste and cost.

Zymet, Inc


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