Industry News: uv wafer irradiation equipment (Page 1 of 4)

All about Semiconductor

Industry News | 2018-12-08 03:37:02.0

All about Semiconductor

Flason Electronic Co.,limited

> FREE Registration for June 12-13, held in The Netherlands

Industry News | 2013-05-01 12:45:51.0

Held at the Rijckholt Castle and Nordson ASYMTEK European Headquarters in Maastricht

ASYMTEK Products | Nordson Electronics Solutions

Vacuum reflow welding technology of UVLED chip package welding is introduced

Industry News | 2019-12-16 21:42:13.0

The emergence of UVLED is a revolutionary change in the UV curing industry. Its constant light intensity, excellent temperature control, environmental friendly and portable, it is widely used in communication, electronics, optics, printing, medical and other fields.

Beijing Technology Company

Vacuum reflow welding technology of UVLED chip package welding is introduced

Industry News | 2019-12-12 05:22:28.0

The emergence of UVLED is a revolutionary change in the UV curing industry. Its constant light intensity, excellent temperature control, environmental friendly and portable, it is widely used in communication, electronics, optics, printing, medical and other fields. UV curing, mainly using mercury lamp irradiation as the mainstream of the production process, not only pollution of the environment, and the traditional UV lamp high energy consumption, short service life.

Beijing Technology Company

Contrast of UVLED light source with traditional mercury lamp?What are the benefits of UVLED vacuum welding?

Industry News | 2019-12-16 21:31:58.0

TORCH is specialized in r&d and production of high-power UVLED vacuum welding oven, which has been successfully used in many high-power UVLED vacuum welding oven at home and abroad, and can replace imported UVLED vacuum oven seamlessly.

Beijing Technology Company

Temporary Bonding Adhesive for Thin Wafer Handling

Industry News | 2016-08-17 09:26:56.0

AI Technology, Inc. (AIT) manufactures a series of temporary bonding materials for processing temperatures up to 150 Cº. They are well accepted for grinding, dicing, etching, and deposition. AIT customers prefer AIT bonding materials over conventional wax materials specifically because AIT’s products feature ease of use and quick removal, especially for very delicate compound wafers and photonics.

AI Technology, Inc. (AIT)

Essemtec's New Brochure Provides Information about LED Production and Processing

Industry News | 2008-12-06 00:35:38.0

The new brochure �LED Production Systems� from Essemtec , the leading Swiss manufacturer of production systems for electronics, contains comprehensive information on production and processing of LEDs. The eight-page document shows many production solutions for example manufacturing of lenses at board level, phosphor-encapsulation, assembling of LEDs on flex-boards and many more. The new prospectus is now available from Essemtec.

ESSEMTEC AG

The System of X-ray Radiography Non-destructive Testing technology

Industry News | 2021-11-30 01:54:12.0

After more than 100 years of development, X-ray imaging technology has formed a relatively complete X-ray non-destructive testing (NDT) technology system. In order to meet these needs, new detection technologies are constantly innovating, using Xray inline inspection technology. It can not only detect invisible crack or porosity such as aluminum casting , but also qualitatively and quantitatively analyze the detection results to find flaws early.

Unicomp Technology Co., Ltd

Nordson DAGE Receives a Prestigious Global Technology Award for the 4800 Wafer Level Bondtester

Industry News | 2015-11-12 20:18:14.0

Nordson DAGE announces that it was awarded a 2015 Global Technology Award for its 4800 Wafer Level Bondtester. The award was presented to the company during a Tuesday, Nov. 10, 2015 ceremony that took place at the Messe München exhibition center in Munich, Germany during productronica.

Nordson DAGE

Nordson DAGE to Launch New 4800 Wafer Level Bondtester at SEMICON West

Industry News | 2015-06-11 16:18:49.0

Nordson DAGE, a division of Nordson Corporation (NASDAQ: NDSN), will exhibit in Booth #5744 at SEMICON West 2015, scheduled to take place July 14-16, 2015 at the Moscone Center in San Francisco. Nordson DAGE will present the 4800 wafer level Bondtester for the first time in North America.

Nordson DAGE

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