Industry News: vertical chips (Page 1 of 6)

How to Prevent the Tombstone and Open Defects during the SMT Reflow Process

Industry News | 2018-10-18 08:14:11.0

How to Prevent the Tombstone and Open Defects during the SMT Reflow Process

Flason Electronic Co.,limited

Vertical Circuits and Asymtek Enable Next-Generation 3D Interconnect Technology

Industry News | 2008-07-24 17:38:17.0

Scotts Valley, CA � 15 July, 2008 - Vertical Circuits, Inc.(VCI), a leading supplier of advanced 3D die-level interconnect solutions, today announced its recognition of Asymtek, a Nordson company (Nasdaq: NDSN) and leader in dispensing, coating and jetting technologies, as a �Partner in Innovation.� Asymtek's Axiom� automated dispensing system plays a key role in enabling the high-volume manufacturing capability for VCI's 3D vertical interconnect process.

ASYMTEK Products | Nordson Electronics Solutions

International Wafer-Level Packaging Conference (IWLPC) Program Finalized and Registration Now Open

Industry News | 2012-08-02 11:47:58.0

The SMTA and Chip Scale Review magazine are pleased to announce the presentation line-up for the 9th Annual International Wafer-Level Packaging Conference.

Surface Mount Technology Association (SMTA)

Compact Reference Manuals to IPC-A-610E and IPC J-STD-001 Illustrate Acceptance Criteria in a Handy Format for Inspectors and Operators

Industry News | 2010-09-30 00:35:51.0

The new E revisions of IPC’s popular desk reference manuals, IPC-DRM-PTH, Through-Hole Solder Joint Evaluation Training & Reference Guide and IPC-DRM-SMT, Surface Mount Solder Joint Evaluation Training & Reference Guide have been released.

Association Connecting Electronics Industries (IPC)

APEX 04: No Horizontal Turret Chip-Shooters

Industry News | 2004-02-27 09:43:23.0

At APEX 04' not placement machine manufacturer had a turret head chip-shooter in their booth.

Phoenix United Associates, Inc.

Cotco�s New TBL Blue LEDs Maximize Light Extraction Efficiency

Industry News | 2005-02-24 11:44:09.0

TBL Blues are Exclusively Avaialble from Marktech Optoelectronics

Marktech Optoelectronics

Tresky’s Product Technologies Provide High-Quality Solutions for Microelectronics

Industry News | 2013-06-20 19:31:51.0

Tresky, announces that its wide range of die bonder products from simple and inexpensive to fully automatic are designed to provide simple, precise and reliable solutions for many applications within the microelectronics industry.

Tresky AG

VJ Electronix to Feature Summit 1800 Advanced Rework System at APEX 2009

Industry News | 2009-03-17 06:02:48.0

March 2009 � VJ Electronix, Inc., the leader in rework technologies and global provider of advanced X-ray inspection systems, announces that it will showcase the Summit 1800 advanced rework system in booth 2265 at the upcoming 2009 APEX Electronics Manufacturing Exhibition and Conference, scheduled to take place Tuesday, March 31 through Thursday, April 2, 2009, at the Mandalay Bay Hotel & Convention Center in Las Vegas, Nevada, USA.

VJ Electronix

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