Industry News: via (Page 6 of 142)

IPC Honors Best Technical Paper at Annual Meeting

Industry News | 2001-10-18 11:52:16.0

IPC has announced the winner of this year's IPC Annual Meeting Best Technical Paper award. Mike Kittelson and Jess L. Pedigo, from Honeywell Advanced Circuits, received the Best Technical Paper award for A Review of Filling High Density, High Aspect Ratio Vias in A High Volume Printed Circuit Board Industry.

Association Connecting Electronics Industries (IPC)

Two Public Online Equipment Auctions of Major Multilayer PCB Manufacturers: Fela & Tring

Industry News | 2023-09-15 17:32:33.0

The Branford Group ("Branford"), a leader in asset valuation and disposition services, in partnership with Maynards Europe, will be hosting (2) public online auctions to sell surplus assets of Tring and Fela – renowned PCB Manufacturers. The equipment offerings will be available for bidding via two online auction events with Fela closing on September 20th at 11:00 am (CET) and Tring closing on October 4th at 11:00 am (CET)

The Branford Group

IPC-2221B Tackles New Technologies, Techniques

Industry News | 2013-01-15 15:44:14.0

, IPC-2221B, Generic Standard on Printed Board Design, provides a basis for the design of all types of printed boards and addresses areas as diverse as testing, via protection, test coupon designs and surface finishes.

Association Connecting Electronics Industries (IPC)

IPC Adds Nimonik as New Global Standards Subscription Distributor

Industry News | 2024-06-17 12:22:59.0

Effective June 1, 2024, IPC entered into a distribution agreement with Nimonik, a regulatory and standards compliance software company. Nimonik is now able to offer IPC standards products in hard-copy and electronic media format through their online retail store or via an annual subscription.

Association Connecting Electronics Industries (IPC)

SMTA Announces Pan Pacific Symposium Call for Papers

Industry News | 2010-05-30 23:23:13.0

Minneapolis, MN - The Surface Mount Technology Association (SMTA) announces the Call for Papers for the 2011 Pan Pacific Microelectronics Symposium, which will be held January 18-20, 2011 on the Big Island of Hawaii. The symposium focuses on the critical business markets and technologies of microelectronic packaging, interconnection, microsystems technology and assembly. The deadline for abstracts is July 16, 2010.

Surface Mount Technology Association (SMTA)

Pan Pacific 2011 Call for Abstracts

Industry News | 2010-08-17 13:31:00.0

The Pan Pacific Microelectronics Symposium promotes International technical interchange and provides a premier forum for extensive networking among microelectronics professionals and business leaders throughout the Pacific Basin. Participants come from Australia, China, India, Japan, Korea, North America, Southeast Asia, and Taiwan as well as Europe!

Surface Mount Technology Association (SMTA)

KEENAN LOUBSER JOINS IPC AS SENIOR DIRECTOR OF CERTIFICATION PROGRAMS

Industry News | 2014-06-04 10:02:13.0

IPC – Association Connecting Electronics Industries® announces that Keenan Loubser has joined the IPC staff as senior director of certification programs.

Association Connecting Electronics Industries (IPC)

Meet Clariant at IPC APEX EXPO for a one-to-one interview about the unique support for more sustainable electronics’ production and the J-STD-033D-preferred unique moisture-control combo for dry packe

Industry News | 2020-01-13 16:38:18.0

As electronics brands demand more sustainable materials and product reliability across their supply chains, Clariant brings two elements together to uniquely boost moisture-exposure assurance for dry-packed Level 2+ components. It is the only option for semiconductor manufacturers, integrated circuit companies and OEM suppliers to meet latest J-STD-033D preferences and increasing low-halogen & cobalt-dichloride-free specifications.

Clariant Cargo & Device Protection

ACI Offers IPC Online Certification

Industry News | 2020-05-08 14:34:51.0

ACI Technologies is pleased to announce the addition of online certification training for the IPC A-610 "Acceptability of Electronic Assemblies" and the IPC/WHMA A-620 "Requirements and Acceptance for Cable and Wire Harness Assemblies" courses.

ACI Technologies, Inc.

Symposium on Counterfeit Parts and Materials Program Finalized

Industry News | 2022-05-27 14:08:51.0

The SMTA and the Center for Advanced Life Cycle Engineering (CALCE) have announced the 2022 technical program is finalized for the annual Symposium on Counterfeit Parts and Materials. The event will proceed in-person June 28-30, 2022, in College Park, Maryland. Registration is now open via the event website.

Surface Mount Technology Association (SMTA)


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