Industry News | 2010-02-17 19:28:14.0
Minneapolis, MN - SMTA and CALCE are pleased to announce a new Symposium on Avoiding, Detecting, and Preventing Counterfeit Electronic Parts event to be held on the west coast. The new event will take place June 8-10, 2010, in Honeywell Deer Valley, Deer Valley (Phoenix), AZ. The first three symposia were overwhelming successes with participation of part manufacturers, distributors, users, government and law enforcement agencies, legal professionals, authentication technology manufacturers, academic institutions, supply chain and brand protection professionals. Abstracts for presentations are now being accepted through April 9, 2010.
Industry News | 2020-03-26 17:26:34.0
As a result of IPC's advocacy work, the U.S. EPA yesterday announced that it is exploring exemptions to the Toxic Substances Control Act (TSCA) "Fees Rule."
Industry News | 2010-06-30 12:22:22.0
Two IEEE standards on setting criteria for environmentally preferable electronic equipment will soon go to ballot: 1680.2 Draft Standard for Environmental Assessment of Imaging Equipment and 1680.3 Draft Standard for the Environmental Assessment of Televisions...
Industry News | 2020-03-18 19:17:38.0
Clariant's Additives business and Floreon-Transforming Packaging Limited announce an exciting new collaboration to further extend the performance properties and market potential of biopolymers, whilst preserving their environmental benefits.
Industry News | 2010-04-10 02:09:54.0
If a picture is worth a thousand words, the new H revision of IPC-A-600, Acceptability of Printed Boards, is a priceless work of art for fabricators and assemblers, particularly inspectors and product developers. IPC — Association Connecting Electronics Industries® announces the new releases of IPC-A-600H and its companion document the C revision of IPC-6012, Qualification and Performance Specification for Rigid Printed Boards.
Industry News | 2022-10-12 11:23:36.0
In the SMT industry, there are many types of cleaning machines. According to the cleaning things, there are stencil cleaner, PCBA cleaner, Wave Oven Pallet/Fixture cleaner, Mis-Print PCB cleaner, Squeegee cleaner, Nozzle cleaner, PCB surface cleaner and so on.
Industry News | 2009-09-03 13:01:11.0
NASHVILLE — September 2009 — Kyzen, a world leading provider of environmentally responsible precision cleaning products for electronics and high-technology manufacturing operations, announces that Mike Bixenman will hold a presentation titled “Solder Paste Selection Can Improve Cleaning Performance on Highly Dense Medical Electronic Assemblies” at the upcoming Medical Electronics Symposium. The presentation will take place during Session 6, titled “Systems Manufacturing,” chaired by Randy Crutchfield, Product Engineer, Medtronic Microelectronics Center, and will be held on Thursday, September 17, 2009 at Arizona State University in Tempe, AZ.
Industry News | 2019-11-05 22:07:01.0
Tenting a via refers to covering via with soldermask to enclose or skin over the opening. A via is a hole drilled into the PCB that allows multiple layers on the PCB to be connected to each other. A non tented via is just a via that is not covered with the soldermask layer. Leaving these vias exposed or covered has pros and cons depending on the your design and manufacturing requirements.
Industry News | 2019-11-05 22:08:21.0
Via in pad is the design practice of placing a via in the copper landing pad of a component. Compared to standard PCB via routing, via in pad allows a design to use smaller component pitch sizes and further reduce the PCBs overall size. With component manufactures pushing smaller parts every year and the demand from consumers for smaller devices, the usage of via in pad practices by hardware engineers have become more commonplace. In this article, we will discuss the differences between via in pad and traditional vias, when should you use via in pad, and how to design for it.
