Industry News: viscom viscom s-3088 aoi (Page 7 of 16)

Viscom at productronica with outstanding solutions for 3D AOI and 3D AXI

Industry News | 2017-10-12 15:10:33.0

From Nov. 14-17, 2017, at the world's foremost trade fair, productronica 2017, Viscom AG will present its cutting-edge solutions for optical inspection systems with 3D technology under the motto "Solutions for me." Close cooperation with customers and Viscom's decades of expertise have resulted in products that convince with very fast handling, excellent inspection results and the simplest operation. The new developments are focused on the challenges arising from increasing product changes and higher production volumes, miniaturization and Industry 4.0.

Viscom AG

High-Precision Conformal Coating Inspection with a Standard Transport Clearance of 105 mm

Industry News | 2020-11-24 15:18:53.0

Viscom's proven S3088 CCI inspection system ensures high-precision conformal coating inspection of printed circuit boards. The system quickly and reliably detects typical defects such as cracks, coating voids, smearing and splashing. Layer thickness and wet coating can also be analyzed. The S3088 CCI now comes standard with an unmatched upper transport clearance of 105 mm, thus providing even more flexibility during final inspection of fully assembled components.

Viscom AG

Viscom to Highlight Desktop AOI S2088-II at SMTA International 2011

Industry News | 2011-09-21 13:27:22.0

Viscom introduces the S2088-II desktop AOI inspection system to the US market. This new system is designed for automatic optical inspection of paste print, pre- and post-reflow and THT solder joints.

Viscom AG

Viscom presents advantages of 3D bond inspection at electronica

Industry News | 2018-11-14 15:31:00.0

With a wide range of inspection systems and camera modules, Viscom AG is offering outstanding solutions for fast, high-precision wire bond production inspections. At the electronica trade show in Munich from November 13-16, visitors can experience firsthand what 3D measurement contributes to product quality in this field.

Viscom AG

Inspection Technologies from Viscom at NEPCON Vietnam

Industry News | 2023-09-04 14:26:39.0

A well-prepared team from Viscom Asia is ready to welcome visitors to NEPCON Vietnam 2023 in Hanoi. Two machines will represent the wide range of inspection systems developed and manufactured at Viscom AG in Germany: iX7059 PCB Inspection XL (3D AXI) and S3088 ultra chrome (3D AOI). In combination, they cover 100% of today's post-reflow inspection requirements.

Viscom AG

Extraordinarily Realistic 3D AOI from All Perspectives with the Viscom 360View

Industry News | 2016-10-04 16:30:12.0

Viscom has developed advanced software to enable highly precise 3D image acquisition in the automatic optical inspection (AOI) area that the company will display in Stand A1.217 at electronica, scheduled to take place Nov. 8-11, 2016 at the Messe München.The representation of side views of electronic components, a pronounced weak point on many 3D systems with orthogonal cameras, can now be displayed in realistic detail with the angled cameras of the Viscom camera modules on the new 360View.

Viscom AG

Viscom presents the most advanced and comprehensive range of high-speed 3D AOI, SPI and AXI inspection systems at Nepcon South China.

Industry News | 2014-07-28 12:42:54.0

Viscom will present the most advanced and comprehensive SPI, AOI and X-ray portfolio on the market in Booth #A-1C36 at Nepcon South China. Viscom S3088 AOI and SPI systems are designed to flexibly cover even the most challenging requirements, from small series production to high-volume/low-mix. The new XM-3D camera module allows for especially fast inspections, with both high-resolution angled views and 3D analyses.

Viscom AG

Viscom implements groundbreaking 3D technology across its entire product range

Industry News | 2018-11-14 15:34:52.0

Viscom AG will premier a new 3D bond inspection system at electronica 2018 in Munich. The Hanover-based inspection technology expert is thus expanding its diverse 3D product range from 3D SPI, 3D AOI and 3D X-ray technology to include bond inspection, further reinforcing its technology leadership in 3D inline inspection for the electronics manufacturing industry.

Viscom AG

Smyczek Optimizes SMT Processes with Viscom 3D-SPI Process Uplink

Industry News | 2012-08-23 12:36:58.0

Smyczek GmbH & Co. KG, based in Verl, Germany, announces that it has optimized its SMT processes with the implementation of 3D paste inspection with Process Uplink by Viscom.

Martel Marketing Communications, Inc.

Viscom presents the most advanced and comprehensive range of high-speed 3D AOI, SPI and AXI inspection systems at Nepcon South China

Industry News | 2014-07-28 21:55:58.0

Viscom announced today that they will present the most advanced and comprehensive SPI, AOI and X-ray portfolio on the market in Booth #A-1C36 at Nepcon South China, scheduled to take place August 26-28, 2014 at the Shenzhen Convention & Exhibition Center in China.

Viscom AG


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