Industry News | 2013-02-26 16:18:07.0
Engineered Material Systems debuts its DB-1568-1 Low Temperature Cure Die Attach Adhesive for attaching semiconductor die in temperature-sensitive devices.
Industry News | 2013-04-02 13:04:03.0
Techcon Systems, introduces the new TS9200D Series Jet Tech Valve. The Jet Valve will be available to order effective April 10, 2013
Industry News | 2013-04-29 12:50:23.0
Engineered Material Systems debuts its CA-105 Low-Cost Conductive LED Die Attach Adhesive for attaching LEDs and other small semiconductor die to silver and copper lead frames.
Industry News | 2013-06-14 17:52:56.0
Engineered Material Systems, Inc., introduces NR-2500 Liquid Negative Photoresist for use in micro-electromechanical systems (MEMS).
Industry News | 2013-09-05 20:26:22.0
Engineered Material Systems , a leading global supplier of electronic materials for circuit assembly applications debuts its CA-195 High Thermal Conductivity, Low Cost Electrically Conductive LED Die Attach Adhesive for attaching LED and other small semiconductor die to silver and copper lead frames.
Industry News | 2014-06-30 14:25:43.0
YINCAE Advanced Materials, LLC is pleased to announce the availability of the SMT 88 series. SMT 88 is a series of new underfill products that enable a faster cure while being held at room temperature.
Industry News | 2015-05-04 16:04:54.0
Engineered Material Systems introduces its newest conductive adhesive – CA-180. The low-temperature cure conductive adhesive has been designed for die attach and general circuit assembly applications.
Industry News | 2017-06-25 20:33:39.0
SHENMAO Technology, Inc. introduces New Generation Ultra Tacky Flux SMF-WC52 applied in the Flip Chip dipping process. Its high tacky property keeps Chip in place during reflow for excellent soldering performance, while creating outstanding solder joint strength.
Industry News | 2017-12-03 18:33:48.0
Engineered Material Systems is pleased to debut its CA-183 low temperature cure electrically conductive adhesive. The low cost, flexible adhesive is designed for die attach and general circuit assembly applications.
Industry News | 2019-01-15 19:43:33.0
Engineered Material Systems is pleased to debut its TM-6520 low temperature cure adhesive. Designed for die attach and general circuit assembly applications, the adhesive is electrically insulating and offers high thermal conductivity.
