Industry News | 2003-04-24 09:58:05.0
"PRISM" UltraCoat
Industry News | 2003-09-25 13:32:47.0
Reduce waste and cost.
Industry News | 2004-04-27 15:19:57.0
Zymet has introduced a new reworkable underfill encapsulant, CN-1453, designed for BGA encapsulation. Removal of defective BGA's is easily accomplished by heating the component and the underfill encapsulant to 220°C. Underfill encapsulant residues are easily scraped or brushed off.
Industry News | 2009-07-17 18:26:03.0
POWAY, CA — July 2009 — EasySpheres LLC highlights RF741 No-Clean Gel Flux designed for electronic component rework and repair applications.
Industry News | 2010-06-11 14:56:31.0
Techcon Systems, a leading global supplier of fluid dispensing systems and accessories, will exhibit an impressive lineup of products with distributor Pacific Advanced Equipment (M) Sdn Bhd, in stand B06 at the upcoming NEPCON Malaysia. The event is scheduled to take place June 15-17, 2010, at the Penang International Sports Arena (PISA).
Industry News | 2012-01-24 20:17:30.0
Seika Machinery will introduce the AI-TEC PCB Coating and Curing System in Booth #2401 at the upcoming IPC APEX Expo.
Industry News | 2012-11-06 11:22:15.0
Dispensing and MID (Molded Interconnected Devices) technologies are developing rapidly. Current technology drivers are LED and communication products. On September 28th, Essemtec’s technology day focused on new developments and future challenges. The event was free of charge for all participants.
Industry News | 2015-11-03 20:02:56.0
Device integration and especially advanced packaging drive electronic systems personal mobility. Packaging technologies, manufacturing solutions, as well as the business models that support production must evolve to meet the challenges that this new era of mobile miniturization will produce.
Industry News | 2018-01-28 20:07:34.0
Engineered Material Systems is pleased to debut its 506-03A/B, which is a two-component epoxy system with a convenient 1:1 volumetric mix ratio designed to pass rigorous reliability requirements.
Industry News | 2018-09-05 20:16:30.0
Engineered Material Systems debuts CA-188-1 low-temperature cure electrically conductive adhesive for die attach and general circuit assembly applications.
