Industry News | 2010-09-30 00:35:51.0
The new E revisions of IPC’s popular desk reference manuals, IPC-DRM-PTH, Through-Hole Solder Joint Evaluation Training & Reference Guide and IPC-DRM-SMT, Surface Mount Solder Joint Evaluation Training & Reference Guide have been released.
Industry News | 2012-05-04 09:21:15.0
As printed boards evolve and chip speeds increase, the use of microwave technology in commercial applications, such as cell phone towers and in military products, is expanding.
Industry News | 2011-03-31 11:54:23.0
Over the past few years, pad cratering has become a vexing problem in lead-free assemblies, largely attributed to problems with the resin used to make a printed board. To help industry eliminate the defect and, at the same time, cut costs, IPC — Association Connecting Electronics Industries® has released IPC-9708, Test Methods for Characterization of PCB Pad Cratering.
Industry News | 2010-05-07 16:01:14.0
New this year! The SMTA International Technical Committee invites you to participate in a poster session at SMTA International. Poster sessions are presented on the show floor and are a great way to present current research and results in a concise manner without requiring a technical paper.
Industry News | 2013-11-05 15:50:55.0
MatriX Technologies will debut its latest innovation in semiautomated X-ray inspection — the XT-3 — in Hall A2, Booth 159 at the productronica International Trade Fair, scheduled to take place November 12-15, 2013 at the New Munich Trade Fair Centre in Munich, Germany.
Industry News | 2019-11-05 22:08:21.0
Via in pad is the design practice of placing a via in the copper landing pad of a component. Compared to standard PCB via routing, via in pad allows a design to use smaller component pitch sizes and further reduce the PCBs overall size. With component manufactures pushing smaller parts every year and the demand from consumers for smaller devices, the usage of via in pad practices by hardware engineers have become more commonplace. In this article, we will discuss the differences between via in pad and traditional vias, when should you use via in pad, and how to design for it.
Industry News | 2020-08-22 04:19:37.0
The Assembly Division of MacDermid Alpha Electronics Solutions will be presenting two technical papers; "Methods of Reducing or Eliminating Voids in BGA and BTC Devices" and "Can Low Cost Silver Free Alloys Be Used in Type II and III Assemblies?" at the SMTA China South Technical Conference taking place from August 26-27 in Shenzhen, China.
Industry News | 2013-04-10 11:30:23.0
VJ Electronix, Inc., announces a recent increase in demand for its Summit LX large format PCB rework systems in its fiscal first quarter.
Industry News | 2016-05-16 20:44:43.0
Inovar, Inc., a full-service EMS provider, announces that it recently purchased and installed an XD7600NT Ruby X-ray Inspection System with X-Plane™ technology from Nordson DAGE.
Industry News | 2019-02-11 21:18:21.0
optical control Americas is pleased to announce that it has entered a manufacturers’ representative agreement with G2 Manufacturing. Under the agreement, John Gilby will represent optical control’s class-leading component counting technology throughout Western Canada.
