Industry News: void profile (Page 1 of 12)

New Technology for Void-free Reflow Soldering

Industry News | 2018-10-18 09:16:42.0

New Technology for Void-free Reflow Soldering

Flason Electronic Co.,limited

SMTA Capital Chapter’s Expo and Tech Forum to be Held on August 22nd

Industry News | 2019-07-09 19:58:49.0

The SMTA Capital Chapter is pleased to invite you to its upcoming Capital Expo and Tech Forum at Johns Hopkins University / Applied Physics Lab, Kossiakoff Center, 11100 Johns Hopkins Road,Laurel, MD 20723, on Thursday, August 22nd.

Surface Mount Technology Association (SMTA)

How to Prevent Solder Joint Voiding and Cold Solder Defects during the SMT Reflow Process

Industry News | 2018-10-18 08:17:09.0

How to Prevent Solder Joint Voiding and Cold Solder Defects during the SMT Reflow Process

Flason Electronic Co.,limited

Technical Presentations at the Upcoming SMTA Capital Chapter Expo on August 23rd

Industry News | 2018-08-16 19:58:50.0

The SMTA Capital Chapter is holding its upcoming Capital Expo and Tech Forum at Johns Hopkins University / Applied Physics Lab, Kossiakoff Center, 11100 Johns Hopkins Road, Laurel, MD 20723, on Thursday, August 23rd.

Surface Mount Technology Association (SMTA)

Updates in IPC-6018B Help Engineers Design High-reliability Boards Specification addresses growing field of microwave technology

Industry News | 2012-05-04 09:21:15.0

As printed boards evolve and chip speeds increase, the use of microwave technology in commercial applications, such as cell phone towers and in military products, is expanding.

Association Connecting Electronics Industries (IPC)

SMT Dictionary – Surface Mount Technology Acronym and Abbreviation

Industry News | 2018-12-08 03:29:29.0

SMT Dictionary – Surface Mount Technology Acronym and Abbreviation

Flason Electronic Co.,limited

MB Allen to Present “Optimization of the Reflow Profile to Minimize Voiding”

Industry News | 2019-07-22 18:08:34.0

KIC announced that MB Allen, Manager for KIC’s Applications & Sales, will present at the SMTA Capital Expo & Tech Forum, scheduled to take place Thursday, Aug. 22, 2019 at the Johns Hopkins University/Applied Physics Lab in Laurel, MD. Allen will present “Optimization of the Reflow Profile to Minimize Voiding.”

KIC Thermal

KIC’s MB Allen to Present “Optimization of the Reflow Profile to Minimize Voiding”

Industry News | 2016-07-18 17:00:38.0

KIC today announced plans to participate in the SMTA Carolinas Chapter Tech Session, scheduled to take place Thursday, August 18th in Greenville, SC. The event will be hosted by Hubbell Lighting, Inc. MB (Marybeth) Allen will present “Optimization of the Reflow Profile to Minimize Voiding.”

KIC Thermal

Optimize Your Reflow Profile at the SMTA New England Expo Booth 604

Industry News | 2016-10-13 15:46:28.0

KIC today announced plans to exhibit at the New England Expo & Tech Forum, scheduled to take place Thursday, November 3, 2016 at the DCU Center in Worcester, MA. MB (Marybeth) Allen will present “Optimization of the Reflow Profile to Minimize Voiding.”

KIC Thermal

MB Allen to Present Recent Research at the SMTA Space Coast Expo

Industry News | 2016-10-17 18:55:57.0

KIC today announced plans to exhibit at the SMTA Space Coast Expo & Tech Forum, scheduled to take place Thursday, Nov. 17, 2016 at the Melbourne Auditorium in FL. MB (Marybeth) Allen will present “Optimization of the Reflow Profile to Minimize Voiding” at 11 a.m.

KIC Thermal

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