Industry News: voiding in d paks (Page 2 of 4)

Ersa to Present on Void Reduction in Reflow Soldering during SMTAI

Industry News | 2016-09-07 19:04:13.0

Kurtz Ersa North America is pleased to announce that Viktoria Rawinski, Assistant to the CEO of the Kurtz Ersa Group and head of the Kurtz Ersa Company Museum and the Corporate History Department, will present the paper entitled, “Void Reduction in Reflow Soldering Processes by Sweep Stimulation of PCB Substrate – Process Integration in Industrial Production,” during SMTA International. The presentation is scheduled to take place during Session MFX4, entitled, “Reflow and Soldering Technology: Void Reduction” on Wednesday, September 28, 2016 from 10:30 a.m. to 12 p.m. in Room 49.

kurtz ersa Corporation

Scanning Acoustic Microscopy Analyzes 3D Packages in the Z-dimension

Industry News | 2019-05-31 08:50:57.0

Non-destructive testing of 3D packages with scanning acoustic microscopes identifies defects down to sub-micron level for 100% inspection, failure analysis

PVA TePla America

Scanning Acoustic Microscopy Analyzes 3D Packages in the Z-dimension

Industry News | 2019-05-31 08:56:07.0

Non-destructive testing of 3D packages with scanning acoustic microscopes identifies defects down to sub-micron level for 100% inspection, failure analysis

PVA TePla America

Indium Corporation’s Insight on Solder Preforms to Reduce Voiding in Bottom Termination Components

Industry News | 2015-10-30 15:33:26.0

Indium Corporation announces the release of its newest informational video that describes how solder preforms can reduce voiding in bottom termination components.

Indium Corporation

TORCH IGBT vacuum reflow oven presented at power semiconductor industry meeting in Hunan province in 2019

Industry News | 2019-12-09 06:31:52.0

Recently, the 2019 Hunan power semiconductor industry conference and the fifth international academic forum of China IGBT technology innovation and industry alliance were held in Zhuzhou, Hunan province.

Beijing Technology Company

Canon Communications Successfully Launches Co-Located Event in Chicago Area.

Industry News | 2007-10-05 20:13:33.0

Los Angeles, CA (October 5, 2007) � Canon Communications, the leading publisher, trade show producer, and digital media company for the world's $3 trillion advanced, technology-based manufacturing industry, today announced figures confirming the successful launch of its latest co-located event.

UBM Canon

Kurtz Ersa to Show New Innovations in the U.S. for the First Time at APEX

Industry News | 2016-02-15 20:36:38.0

Kurtz Ersa North America will exhibit in Booth #1326 at the 2016 IPC APEX EXPO, scheduled to take place March 15-17, 2016 at the Las Vegas Convention Center. Ersa will introduce its new line of selective solder, reflow and rework equipment and more.

3M Electrical Solutions Division

Pemtron to Show AOI in a New Light at the SMTA Queretaro Expo

Industry News | 2023-06-13 18:33:43.0

Pemtron Technology is pleased to announce plans to exhibit at the SMTA Queretaro Expo and Tech Forum, scheduled to take place Thursday, July 13, 2023 at the EXPO HALL Hotel Misión Juriquilla. Jaime Arreola, Pemtron's MX General Manager, will be available at the event to meet with customers and discuss the company's cutting-edge Athena 3D Automated Optical Inspection (AOI) System and TROI 8800 CI Series Conformal Coating Inspection System.

Pemtron

Saki Demonstrates 3D AOI and 3D AXI Off-line Programming Live at SMTA International in Booth 430

Industry News | 2019-09-10 13:30:52.0

Saki Corporation will present its 3D automated optical inspection (AOI) system and BFX-Editor automated x-ray inspection (AXI) off-line programming and debugging software at SMTA International in booth 430.

SAKI America

ViTrox Technologies' V810 Selected as Finalist for 2012 Best in Test Awards

Industry News | 2011-11-03 21:29:45.0

ViTrox Technologies announces that its V810 Automated 3-D In-Line X-ray Inspection System has been selected as a finalist for the 2012 Best in Test Awards.

ViTrox Technologies


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