Industry News | 2003-05-05 09:21:23.0
Features a 50% Reduction in Length
Industry News | 2003-01-24 09:07:53.0
For Industrial, Telecom and Datacom Use
Industry News | 2003-04-28 08:12:02.0
The Micro-Meter 2 is an air-operated positive-displacement single-acting two-component system, designed to meter, mix and dispense small 'shots', or beads, of reactive materials.
Industry News | 2003-06-03 08:20:48.0
Designed for fast and easy DIN-rail mounting
Industry News | 2003-05-28 08:28:54.0
For June 2-4 (Mon. - Wed.)Design Automation Conference 2003
Industry News | 2018-04-22 19:12:45.0
SMTA Europe announces Session 7 Technical Program on High Temperature PCB Materials and Fabrication at the “Electronics in Harsh Environments Conference” to be held in Amsterdam, Netherlands, on April 25th, 2018.
Industry News | 2012-06-01 13:55:57.0
As chip speeds skyrocket and system sizes diminish, designers and manufacturers face new and complex challenges
Industry News | 2018-10-18 09:14:05.0
Lead-free processes propose new requirements on reflow soldering quality
Industry News | 2019-12-10 16:28:35.0
The following statement can be attributed to John Mitchell, IPC president and CEO: “We are pleased that leaders in the U.S. Congress and the Trump administration, as well as the governments of Canada and Mexico and key stakeholders, have reached consensus on USMCA. The agreement is a positive step for the electronics manufacturing industry and millions of U.S. workers and consumers. By prioritizing a modernized and strengthened trade relationship between the U.S., Canada and Mexico, all three nations can strengthen the region's supply chains, expand trade opportunities with partners abroad, and reinforce North America as a bastion of strength and stability in an uncertain world.
Industry News | 2010-12-17 01:47:04.0
IPC has released the A revision of IPC-2222, Sectional Design Standard for Rigid Organic Printed Boards. Helping developers avoid common missteps that reduce board manufacturability, IPC-2222 has been expanded to include more information on board materials, such as relative costs, tolerances of board thickness, unsupported holes, and hole aspect ratios.
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