Industry News | 2017-03-08 19:49:16.0
ORBOTECH LTD. (NASDAQ: ORBK) today announced that SPTS Technologies, an Orbotech company and a supplier of advanced wafer processing solutions for the global semiconductor and related industries, has won an order for its Mosaic Plasma Dicing System from JCAP Corporation (Jiangyin Changdian Advanced Packaging Co., Ltd), a JCET company and leading Chinese advanced packaging services provider to global semiconductor companies. Orbotech's SPTS also announced that a recent analysis of MEMS microphones in the iPhone 7 Plus conducted by System Plus Consulting[1] confirmed that an ASIC device in the iPhone 7 Plus had been plasma diced.
Industry News | 2013-11-18 16:42:52.0
Microtronic GmbH has entered into a strategic partnership with Loadpoint to offer a dicing and grinding service.
Industry News | 2004-06-21 10:03:41.0
Westwind Air Bearings, the World�s leading spindle supplier to the semiconductor industry, is proud to announce its participation at SEMICON West 2004, held at the Moscone Centre, San Francisco, from 12th to 14th July 2004.
Industry News | 2016-08-17 09:26:56.0
AI Technology, Inc. (AIT) manufactures a series of temporary bonding materials for processing temperatures up to 150 Cº. They are well accepted for grinding, dicing, etching, and deposition. AIT customers prefer AIT bonding materials over conventional wax materials specifically because AIT’s products feature ease of use and quick removal, especially for very delicate compound wafers and photonics.
Industry News | 2015-02-22 17:49:35.0
Practical Components has added the WALTS Co., LTD to its extensive line of Dummy Components and Test Boards. Headquartered in Fukuoka, Japan, WALTS Co., LTD. develops and provides advanced test element group wafers (TEG) die/test kits. Their high-technology wafers are used extensively worldwide in wide ranging applications. WALTS collaborates on research with academic institutes on advanced assembly technologies. WALTS offers film sputtering and deposition, backgrinding, dicing service on test wafer/glass.
Industry News | 2018-10-15 18:31:07.0
Practical Components announces that it will display its latest technology in booth 827 at the upcoming IWLPC 2018 – 15th Annual International Wafer-Level Packaging Conference. IWLPC brings together some of the semiconductor industry's most respected authorities addressing all aspects of wafer-level, 3D, TSV, and MEMS device packaging and manufacturing. The event will take place October 23 - 25, 2018 at the DoubleTree by Hilton San Jose in San Jose, CA.
Industry News | 2018-10-18 19:55:33.0
Practical Components announces that it will display its latest technology in booth 827 at the upcoming IWLPC 2018 – 15th Annual International Wafer-Level Packaging Conference. IWLPC brings together some of the semiconductor industry's most respected authorities addressing all aspects of wafer-level, 3D, TSV, and MEMS device packaging and manufacturing. The event will take place October 23 - 25, 2018 at the DoubleTree by Hilton San Jose in San Jose, CA.
Industry News | 2014-05-07 16:11:10.0
AI Technology (AIT) Releases Electrically and Thermally Conductive 20 Micron Wafer Level Die-Attach Film (DAF), Combines High Glass Transition Temperature and Stress Absorption with Proven Thermal Performance in Die-Attach Power Dissipation.
Industry News | 2021-07-15 03:55:39.0
The latest fixtureless technology available for production and validation testing the most challenging Probe Cards
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