Industry News | 2009-08-20 15:26:58.0
To progress development of its next-generation pre-applied underfill materials, LORD Corporation has selected DEK’s award-winning Galaxy platform. LORD, a Cary, North Carolina-based leading manufacturer of electronic materials, found the precision, accuracy and process capability of the Galaxy simply unmatched and, therefore, the ideal system to enable its materials innovation initiatives.
Industry News | 2023-08-14 12:12:00.0
SHENMAO America, Inc. is pleased to announce the availability of its PF735-LT201 Low-Temperature Lead-Free No-Clean Solder Wire. This advanced solder wire is designed to meet the evolving needs of the electronics industry, offering exceptional solderability and reliability for low-temperature PCBA soldering and rework processes.
Industry News | 2002-04-24 08:49:13.0
Alphasem Expects to Purchase Approximately $1.3 Million of Cognex's MVS 8100 Machine Vision Systems Over the Next 18 Months
Industry News | 2020-01-07 11:42:27.0
Practical Components announces that it will showcase its advanced technologies at the IPC APEX exhibition in booth 1600 scheduled to take place February 4-6, 2020 at the San Diego Convention Center in San Diego California.
Industry News | 2024-06-17 12:25:09.0
Sono-Tek Corporation (Nasdaq: SOTK) is excited to announce its participation in SEMICON West 2024, taking place July 9-11 in San Francisco, CA. Visit the company at booth 6186 to explore advanced ultrasonic coating solutions designed for precision and efficiency in semiconductor manufacturing.
Industry News | 2014-09-05 13:53:06.0
AI Technology, Inc (AIT) Develops Temporary Bonding Wax for Precision Wafer and Substrate Back-grinding and Thinning Applications. AI Technology, Inc. (AIT) has recently developed a series of temporary wax-like media that has been proven to be useful in many of these thinning applications.
Industry News | 2014-11-07 10:35:14.0
AI Technology is proud to announce that it will be attending two conferences this November. The first conference AIT will be attending is the International Wafer-Level Packaging Conference (IWLPC), November 11-12 at the Double Tree Hotel in San Jose, CA. This year, AIT's own Dr. Frederick Lo will be presenting his paper, Recent Advances in Die Attach Film.
Industry News | 2014-06-25 12:31:01.0
Panasonic Factory Solutions Company of America will debut a process-flexible flip chip bonder at this year’s Semicon West as part of its high-speed, low-cost manufacturing solutions for highly advanced devices.
Industry News | 2023-06-02 01:14:14.0
ViTrox, which aims to be the world's most trusted technology company, is thrilled to announce its participation in SEMICON China 2023, one of the largest semiconductor industry events in China, at Hall E4, Booth #E4651 in Shanghai New International Expo Centre (SNICE), China from 29th June to 1st July 2023.
Industry News | 2014-04-10 10:17:27.0
AI Technology has just increased its manufacturing capacity to more than 10 million square feet of its 10 micron thick ESP7660 series of insulating DAF for memory stacked chip applications and its 20 micron thick ESP8660 series of conductive DAF for power devices.
