Industry News | 2012-08-02 11:47:58.0
The SMTA and Chip Scale Review magazine are pleased to announce the presentation line-up for the 9th Annual International Wafer-Level Packaging Conference.
Industry News | 2016-08-23 16:25:55.0
The SMTA and Chip Scale Review magazine are pleased to announce the Workshops for the 13th Annual International Wafer-Level Packaging Conference (IWLPC). On Thursday, October 20, there will be professional workshops given by instructors who are pre-eminent authorities in their fields. IWLPC will be held October 18-20, 2016 at the DoubleTree Airport Hotel in San Jose, California.
Industry News | 2019-11-03 15:33:45.0
Nordson Test and Inspection will exhibit in Hall A2, Stand 445 at productronica, scheduled to take place Nov. 12-15, 2019 at the Neue Messe München in Munich, Germany. Systems from Nordson DAGE, MATRIX, SONOSCAN AND YESTECH will be available for demonstrations.
Industry News | 2013-10-24 13:54:32.0
Virtual Industries Inc. announces that it will display three new and advanced systems for part handling in Stand #B2.259 at the 20th international Productronica International Trade Fair, scheduled to take place November 12 - 15, 2013 at the New Munich Trade Fair Centre in Munich, Germany.
Industry News | 2012-06-05 14:38:18.0
Multitest, announces that its InCarrier™ Loader/Unloader is available in a variety of configurations, e.g. for loading from tube, bowl, tray and for unloading into tube, bulk or metal mag in any combination.
Industry News | 2010-07-29 14:33:02.0
Milara Inc., a leading vendor of fully and semiautomatic stencil printers for SMT and wafer applications, introduces the Diamond Series Wafer Handling Robots.
Industry News | 2005-12-20 10:08:07.0
PROMATION has developed a line of 200 mm and 300 mm wafer handling systems for loading the line and unloading the line.
Industry News | 2009-11-11 12:30:16.0
Medfield, MA — November 2009 — Milara Inc. announces that it has been awarded a Global Technology Award in the category of Wafer Level Products for its Diamond Wafer Handling Robots. The award was presented to the company during a Tuesday, November 10, 2009 ceremony that took place at the New Munich Trade Fair Center in Munich, Germany.
Industry News | 2010-06-21 16:04:54.0
Demonstrating its extensive knowledge base for today’s demanding back-end wafer level processes, DEK’s presence at the upcoming Semicon West event in San Francisco, California will feature the Galaxy print platform with Wafer Transport Solution. This system, displayed alongside the CHAD WaferMate 300-1, is configured with a precision wafer pallet and high-performance transport rails, ensuring the accuracy and stability required for DEK’s established and emerging cost-effective Wafer Level Packaging (WLP) applications.
Industry News | 2016-08-17 09:26:56.0
AI Technology, Inc. (AIT) manufactures a series of temporary bonding materials for processing temperatures up to 150 Cº. They are well accepted for grinding, dicing, etching, and deposition. AIT customers prefer AIT bonding materials over conventional wax materials specifically because AIT’s products feature ease of use and quick removal, especially for very delicate compound wafers and photonics.
