Industry News | 2003-01-27 10:27:31.0
At a New Facility Within the Company's U.S. Headquarters
Industry News | 2002-03-29 08:28:28.0
Has Found a Buyer for its Wafer Fabrication Facility in Plymouth, England
Industry News | 2009-12-03 22:49:57.0
Gene F. Wakefield Passed away on November 29, 2009 after a courageous battle with pancreatic cancer. He was born on December 22, 1933 in Albuquerque, New Mexico. He is survived by his wife, LaJuana. He leaves behind a daughter, Marvel Wakefield (Los Angeles, CA), two brothers, John Wakefield (Crawford, CO) and Roy Wakefield (Truckee, CA), three sisters, Lila Craig (Colorado Springs, CO), Mary Alyce Krist (Ft. Collins, CO) and Margaret Ann Foss (Buffalo, WY).
Industry News | 2003-07-09 09:00:46.0
He will have responsibility for all aspects of Photronics� manufacturing and sales activities in China, Singapore and Taiwan.
Industry News | 2008-01-23 10:59:08.0
San Jose, CA - �The International Wafer-Level Packaging Conference (IWLPC) has issued a call for papers for its fifth annual program on Oct. 13-16 at the Wyndham Hotel in San Jose.
Industry News | 2021-08-13 12:11:05.0
The Wafer-Level Packaging Symposium is scheduled for February 15-17, 2022 in San Jose, CA, USA. The theme of the event is "Advanced Packaging: The Dawn of a New Era." The development of Advanced Package Technology is undergoing a massive change because Electrical System Architects are directly driving package performance requirements.
Industry News | 2021-12-21 14:47:13.0
The SMTA is pleased to announce the technical program for the Wafer-Level Packaging Symposium (WLPS). The symposium will be held February 15-17, 2022 at the DoubleTree by Hilton Hotel in San Jose, California.
Industry News | 2015-04-07 15:57:40.0
SMTA and Chip Scale Review magazine are pleased to announce plans for the 12th Annual International Wafer-Level Packaging Conference and Tabletop Exhibition. This premier industry event explores leading-edge design, material, and process technologies being applied to Wafer-Level Packaging applications. There will be special emphasis on the numerous device and end product applications (RF/wireless, sensors, mixed technology, optoelectronics) that demand wafer level packaging solutions for integration, cost, and performance requirements.
Industry News | 2019-07-16 19:36:51.0
The Surface Mount Technology Association (SMTA) and Chip Scale Review are pleased to announce the program for the 16th annual International Wafer-Level Packaging Conference (IWLPC). The conference will be held October 22-24, 2019 at the DoubleTree by Hilton Hotel in San Jose, California.
Industry News | 2015-01-15 19:44:09.0
SMTA and Chip Scale Review magazine announced the best papers from the 2014 International Wafer-Level Packaging Conference (IWLPC.) Winners were selected from each of the three tracks covering Wafer Level Packaging, 3-D (Stacked) Packaging, and MEMS Packaging, as well as an overall Best Paper and Best of Conference winner. IWLPC brings together some of the semiconductor industry's most respected authorities addressing all aspects of wafer-level, 3D, TSV, and MEMS device packaging.