Industry News | 2014-03-19 13:27:35.0
Koh Young America and Koh Young Technology (Seoul, Korea) will demonstrate exciting new breakthroughs in PCB inspection at IPC/APEX 2014 in Las Vegas, Nevada this coming week.
Industry News | 2023-10-09 09:18:52.0
Indium Corporation Junior Application Engineer Siegfried Lorenz will present at the 2023 LED Meets SMT forum on October 25 in Leinfelden-Echterdingen. The forum, featuring innovative presentations by partners from across the industry, focuses on the processing of LEDs in electronics manufacturing.
Industry News | 2019-01-10 16:30:44.0
NP505-LT is a no-clean, lead-free, zero-halogen solder paste for assemblies that have temperature sensitive substrates and components.
Industry News | 2010-03-15 13:23:37.0
Rehm Thermal Systems has introduced new cooling zone designs for their Vision Series convection reflow ovens. The new technology is particularly effective for the homogenous cooling of large thermal mass PCBs.
Industry News | 2013-01-23 13:35:10.0
Koh Young's award-winning patented 3D inspection technology is 'hitting the road' with a whirlwind Truck Tour of the United States, beginning at the Koh Young exhibit booth (#143) at IPC/APEX 2013, February 19 - 21, at the San Diego Convention Center.
Industry News | 2010-04-29 08:33:15.0
SIPLACE CA combines die-bonding and SMT placement to meet current trends in packaging of integrated circuits
Industry News | 2009-06-23 20:26:31.0
Debuting its most recent technology advance, mass imaging leader DEK will showcase the company’s new thin wafer processing expertise from booth #811 at the upcoming Semicon West event in San Francisco, California. A full line solution that incorporates a Galaxy Thin Wafer System and a next-generation CHAD WaferMate™ wafer handler, this latest development resolves traditional challenges associated with high-speed handling and processing of thinned wafers on a proven print platform.
Industry News | 2014-09-09 12:33:50.0
– Panasonic Factory Solutions Company of America introduces the NPM-D3 to the award-winning, multi-functional NPM-series SMT platform. In addition to its interchangeable, plug-and-play placement heads, the NPM-D3 integrates solder paste inspection (SPI), adhesive dispense (ADH), and post-placement inspection (AOI).
Industry News | 2018-05-09 11:20:04.0
oh Young was presented with the SMT China VISION Award for its Zenith 3D Automated Optical Inspection (AOI) at NEPCON China on April 24 in Shanghai, China. Koh Young was one of only six VISION Award winners within Inspection & Testing category, thanks in part for advancing the SMT industry with innovative SMT process technologies.
Industry News | 2020-08-22 04:07:55.0
Indium Corporation will host an InSIDER Series webinar on causes and solutions of PCB and component warpage defects, presented by industry consultant Bob Willis. There will be two sessions on Wednesday, Sept. 9--5:30 a.m. Eastern Time (10:30 a.m. London Time, 5:30 p.m. Malaysia Time) and Noon Eastern Time (5 p.m. London Time, Midnight Malaysia Time).
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