Industry News | 2023-10-30 18:56:16.0
Seika Machinery, Inc. is pleased to announce that it was honored with a 2023 Mexico Technology Award in the category of Routers. The award was announced during a ceremony that took place Wednesday, Oct. 25, 2023 during SMTA Guadalajara in Mexico. The company's cutting-edge SAYAKA PCB Router SAM-CT34XJ Stand Alone & In-Line Solution was celebrated as the ultimate solution for stress-free PCB depaneling.
Industry News | 2009-10-13 13:32:00.0
As the world’s leading exhibition for electronics manufacturing, Productronica 2009 delivers an ideal platform for Rehm Thermal Systems to showcase its range of Convection and Condensation as well as Vacuum Condensation Systems, along with a live demonstration of its popular Pyrolysis residue management technology. The Rehm team will also reveal solar equipment or the metallization line at the show, being held in Munich from November 10th – 13th.
Industry News | 2010-06-21 16:04:54.0
Demonstrating its extensive knowledge base for today’s demanding back-end wafer level processes, DEK’s presence at the upcoming Semicon West event in San Francisco, California will feature the Galaxy print platform with Wafer Transport Solution. This system, displayed alongside the CHAD WaferMate 300-1, is configured with a precision wafer pallet and high-performance transport rails, ensuring the accuracy and stability required for DEK’s established and emerging cost-effective Wafer Level Packaging (WLP) applications.
Industry News | 2013-01-12 12:27:34.0
With its new SIPLACE Very-High-Force Head for odd-shaped components, ASM Assembly Systems is adding another major option for its SIPLACE SX placement machines. The new Very-High-Force Head is able to place components up to 30 millimeters high and 200 millimeters long with a force of up to 70 newtons. That way, users can process on their SMT line even extremely large components with snap-in or through-the-hole fasteners such as connector modules for automotive or IT applications.
Industry News | 2013-03-12 13:42:20.0
With new SIPLACE placement machines and many software innovations, ASM Assembly Systems underscores how important the SMT Hybrid Packaging trade show in Nuremberg has become. At Booth 7-204, the SIPLACE team will present innovations from both ends of its platform spectrum: With the SIPLACE X3 S, it unveils the latest generation of the successful SIPLACE X high-end platform, while the SIPLACE D1i is a new solution for the more price-sensitive SMT production segment.
Industry News | 2021-07-22 15:00:19.0
Technology leader ASM will present its latest innovations for the electronics manufacturing industry in a livestream on September 1, 2021. "ASM Impact – Release Summer 2021" will focus mostly on process improvements across the whole spectrum ranging from printing, inspection and placement to fully integrated software solutions. Examples include enhancement for DEK TQ and DEK NeoHorizon solder paste printers as well as for the AMS ProcessLens SPI system, along with new, smart SIPLACE feeder solutions. The event will also feature new functions and enhancements for the ASM Works smart factory suite. Another highlight will be the extensive capabilities of the ASM Factory Equipment Center solution for company-wide and non-proprietary asset and maintenance management. For more details about the event and to register, visit https://asm-smt-events.com/.
