Industry News: wedge and bond (Page 8 of 24)

Techcon Announces New Branding, Features and Products

Industry News | 2017-10-24 17:17:49.0

Techcon today unveiled a new logo and brand identity at The Assembly Show in Rosemont, IL. The brand launch is being rolled out in conjunction with a series of innovative new products from Techcon, beginning with the TS550R Smart Valves Controller, which can remotely control the Techcon pneumatic valve series via mobile or desktop computer, or via intuitive touch screen controls.

Techcon Systems

Four types of plasma surface treatment and material surface reaction

Industry News | 2021-04-09 02:12:31.0

The reaction between the plasma surface treatment machine and the surface of the material is both physical and chemical. Through the reaction, the surface of the material will become rough, and at the same time, the oxide can be reduced, making the surface of the material hydrophilic and cohesive. Dyeability, biocompatibility and electrical properties have been greatly improved.

DONGGUAN KEQI AUTOMATION EQUIPMENT CO.,LTD

Nordson Test and Inspection to Exhibit Best-in-Class Bondtest, X-ray and Automated Optical Inspection Systems at Productronica

Industry News | 2015-11-02 21:51:21.0

Nordson DAGE and Nordson YESTECH, divisions of Nordson Corporation (NASDAQ: NDSN), will exhibit their range of market leading Test and Inspection systems at Productronica – Stand A2:361 scheduled to take place November 10-13, 2015 at the Messe Munich Exhibition Centre in Germany. Following the acquisition of MatriX Technologies GmbH by the Nordson Corporation, the new MatriX 2.5# Automated X-ray Inspection system will also be displayed on the stand.

Nordson DAGE

Semiconductor and Advanced Packaging Inspection at SEMICON Taiwan 2020

Industry News | 2020-08-07 05:21:03.0

Test Research, Inc. (TRI) is pleased to announce that it will be featuring Test and Inspection solutions for Semiconductor and Advanced Packaging Production Lines at SEMICON Taiwan 2020. Visit TRI at booth # J2534 to discover High-Precision Inspection for the Semiconductor Industry at Taipei Nangang Exhibition Center Hall 1.

TRI - Test Research, Inc. USA

PVA and AlphaGlobal Offer Automated Dispensing at the KPCA Show

Industry News | 2022-08-26 09:44:19.0

PVA today announced plans to exhibit with its distributor, AlphaGlobal, at the KPCA Show, scheduled to take place Sept. 21-23, 2022 in Korea. Paul Kim, Regional Sales Manager for Asia Pacific, will discuss PVA's complete range of coating and dispensing capabilities, including its new 5th Axis Tilt feature and Valve Tool Changer in Booth K301.

Precision Valve & Automation (PVA)

New development from the SIPLACE Technology Network - The new SIPLACE CA application: Die-bonding and SMD placement in a single machine

Industry News | 2009-05-29 12:27:20.0

Technology leader Siemens Electronics Assembly Systems (SEAS) unveils the new combined die-bonding and SMD placement application SIPLACE CA. Based on the SIPLACE X-series platform, it is the world's first machine that combines the highest of SMD placement speed with the extreme precision of die-bonding.

Siemens Process Industries and Drives

Effective August 1, 2020, Nordson Corporation has discontinued the Hot Bar Soldering and Bonding line of products as marketed under the name of Nordson DIMA.

Industry News | 2020-10-12 13:22:22.0

We are pleased to announce and introduce C-Tech Systems, B.V. as the company that will be assuming the Hot Bar Soldering and Bonding product lines, including continuing support of all customers currently using the products. For sales and service support of Hot Bar Soldering and Bonding product lines, visit the C-Tech Systems website. Visit the Nordson ELECTRONICS SOLUTIONS site for information on precision fluid dispensing, plasma treatment, selective soldering and test and inspection capabilities.

Nordson Corporation

Nordson DAGE to Exhibit Next-Generation Bond Testing and Inspection Technologies at IMAPS 2011

Industry News | 2011-09-12 11:53:55.0

Nordson DAGE will highlight its latest bond testing and X-ray inspection capabilities in Booth #512 at the upcoming IMAPS 44th International Symposium on Microelectronics.

Nordson DAGE

Nordson DAGE to Exhibit Next-Generation Bond Testing and Inspection Technologies at ISTFA 2011

Industry News | 2011-10-16 00:05:15.0

Nordson DAGE will highlight its latest bond testing and X-ray inspection capabilities in Booth #326 at the upcoming International Symposium for Testing and Failure Analysis (ISTFA).

Nordson DAGE

Nordson DIMA introduces new inline concept for hot bar bonding and soldering at Productronica 2017

Industry News | 2017-11-08 15:24:31.0

Nordson DIMA, a division of Nordson Corporation (Nasdaq NDSN), will exhibit a range of products at Productronica, the world’s leading trade fair for electronics development and production, to be held in Munich, Germany, on November 14-17, 2017, in Hall A2, stands 345 and 578.

C-Tech Systems, B.V. [formerly Nordson DIMA]


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