Industry News | 2015-04-07 15:34:16.0
Microtronic GmbH, a leading sales specialist of microelectronics, will display a range of products in Booth # 7-101L at SMT/Hybrid/Packaging, scheduled to take place May 5-7, 2015 at the Messe in Nuremberg, Germany.
Industry News | 2012-04-07 08:05:51.0
AIM, a leading global manufacturer of solder assembly materials for electronics assembly, PC fabrication, component manufacturing and other industries, has appointed Circuit Technology Incorporated (CTI) as its representative in North and South Carolina effective April 6, 2012.
Industry News | 2012-01-24 20:35:41.0
AIM announces that Karl Seelig, Vice President of Technology, will discuss the reliability of lead-free alloys at the upcoming PB-Free Electronics Risk Management (PERM) Consortium Meeting, scheduled to take place January 31-February 2, 2012 in Arlington, Va.
Industry News | 2012-07-25 10:17:38.0
AIM, will highlight its new NC259 Solder Paste
Industry News | 2012-01-20 15:08:03.0
AIM will debut its new NC259 Solder Paste chemistry in Booth #2804 at the upcoming IPC APEX Expo.
Industry News | 2012-01-26 22:30:21.0
AIM announces that Karl Seelig, Vice President of Technology, will present his VOC-Free Flux Study during a technical session entitled Flux.
Industry News | 2012-05-15 11:23:39.0
Tim O’Neill, Northeastern Regional Sales Manager, will present on Lead-Free Alloy Development at the Ohio Valley SMTA Solder Paste Round Table Meeting,
Industry News | 2012-09-18 14:01:32.0
AIMwill present a paper titled “VOC-free Flux Study: Not All Weak Organic Acids Are the Same” at the upcoming PCB West Conference & Exhibition
Industry News | 2011-09-28 19:53:50.0
AIM announces that Karl Seelig, Vice President of Technology, will present a paper titled “Overcoming the Challenges of QFNs” at the upcoming SMTA International Conference & Exhibition.
Industry News | 2012-04-17 11:22:21.0
AIM will highlight its NC259 no-clean solder paste chemistry in Booth #1A02 at the upcoming NEPCON China 2012.