Industry News | 2010-10-14 16:20:31.0
SEHO Systems GmbH, a worldwide leading manufacturer of soldering systems, has expanded its range of innovative nozzle geometries for wave soldering machines, establishing a new level of quality in electronics production.
Industry News | 2023-05-22 18:45:34.0
SHENMAO America, Inc. is proud to announce the release of its new SMBF-08 Visible No-Clean BGA Flux. This innovative flux is specifically designed to meet the demands of surface mount technology (SMT) assembly and BGA ball mount processes, offering enhanced visibility and performance.
Industry News | 2009-01-21 14:23:25.0
OSAKA, JAPAN � January 2009 � Nihon Superior Co. Ltd., an advanced soldering and brazing supplier to the worldwide market, introduces SN100C P800 power semiconductor lead-free solder paste.
Industry News | 2021-01-30 07:05:46.0
Most wave soldering systems installed in electronic productions are equipped with one or two solder nozzles that generate a turbulent wave. This configuration is ideal for most products; however, this concept reaches its limitations if, for example, PCBs in masks are to be processed. The reliable wetting of all solder jointsis not guaranteed, depending on the thickness of the mask and the size of the cutouts. Additionally, it might be challenging to achieve a reproducible process if the distances between covered SMD components and the THT pins to be soldered are too small. Sophisticated assemblies that are processed in soldering masks often show soldering defects such as incomplete solder joints or solder bridges.
Industry News | 2010-05-20 14:16:20.0
GAINESVILLE, GA - Count On Tools Inc., a leading provider of precision components and SMT spare parts, announces that the company is now manufacturing ACE Bullet nozzles for the KISS range of selective soldering machines.
Industry News | 2023-10-23 09:36:49.0
SHENMAO America, Inc. is proud to introduce its latest breakthrough in soldering technology, the PF606-P276 Ultra-Low Void No-Clean Zero-Halogen Lead-Free Solder Paste. With its exceptional performance, eco-friendly attributes, and adaptability to a wide range of applications, PF606-P276 boasts a series of remarkable features and benefits that set it apart from conventional solder pastes.
Industry News | 2019-10-08 06:12:57.0
SHENMAO America, Inc. is pleased to announce plans to exhibit at the SMTA Guadalajara Expo & Tech Forum, scheduled to take place Oct. 23-24, 2019 at the Expo Guadalajara. The company will show its PF735-PQ10 Low Temperature Solder (LTS) and SM-862 Liquid Flux in Booth #602.
Industry News | 2019-11-25 11:02:32.0
SHENMAO America, Inc. announces that it will exhibit at the SMTA Silicon Valley Expo, scheduled to take place Wednesday, Dec. 4, 2019 at the Bestronics Box Build Facility in San Jose, CA. The company will showcase its PF735-PQ10 Low Temperature Solder (LTS) and SM-862 Liquid Flux.
Industry News | 2024-02-12 13:43:22.0
SHENMAO Technology is pleased to announce the availability of its latest innovation, the SMF-D61 Low Residue No-Clean Flip Chip Flux. This advanced flux is meticulously engineered to meet the demanding requirements of flip chip dipping applications, offering exceptional performance and reliability throughout the soldering process.
Industry News | 2012-01-26 22:47:26.0
SEHO Systems GmbH announces that Christian Ott will present a paper titled “Reduction of Voids in Solder Joints: An Alternative to Vacuum Soldering” during the Voiding 1: Process and Test Technical Session on Tuesday, February 28, 2012 from 1:30-3 p.m. at the San Diego Convention Center in San Diego, CA. The paper, authored by Rolf Diehm, Mathias Nowottnick and Uwe Pape, will discuss voids in solder joins as one of the main problems for power electronics.
