Industry News: what is a bga pitch (Page 1 of 2)

What is a Ball Grid Array?

Industry News | 2018-10-18 10:22:15.0

What is a Ball Grid Array?

Flason Electronic Co.,limited

What is a HDI PCB?

Industry News | 2018-10-18 11:05:03.0

What is a HDI PCB?

Flason Electronic Co.,limited

Why is my PCB Assembly Quote so Expensive?

Industry News | 2018-10-18 09:57:05.0

Why is my PCB Assembly Quote so Expensive?

Flason Electronic Co.,limited

Webtorial: Design and Assembly Process Challenges for Bottom Terminations Components (BTCs) such as QFN, DFN and MLF in Tin-Lead & Lead Free World

Industry News | 2013-01-02 16:01:34.0

A Convenienient and informative online tutorial about Design and Assembly Process Challenges for Bottom Terminations Components

Surface Mount Technology Association (SMTA)

Hesse & Knipps is now Hesse Mechatronics.

Industry News | 2013-03-06 10:33:14.0

Hesse Mechatronics (formerly Hesse & Knipps), the Americas subsidiary of Hesse GmbH, formally announces the company's recent name change from Hesse & Knipps, Inc. to Hesse Mechatronics, Inc., effective January 1, 2013.

Hesse Mechatronics

Hesse & Knipps is now Hesse Mechatronics

Industry News | 2013-03-06 10:36:50.0

Hesse Mechatronics, Inc. (formerly Hesse & Knipps), the Americas subsidiary of Hesse GmbH, formally announces the company's recent name change from Hesse & Knipps, Inc. to Hesse Mechatronics, Inc., effective January 1, 2013.

Hesse Mechatronics

Low cost SMT assembly line solution is including 7 machines

Industry News | 2021-04-01 09:23:35.0

Low cost SMT assembly line solution is including 7 machines. It can mount chips: 0201, 0402, 0603, 0805, 1206, diode, transistor, SOT, and QFP/BGA which the size within 40*40mm and lead pitch ≥0.3mm etc. Any inquiry would be appreciated by Mobile/WeChat: 0086 13063047785 or scan my WeChat QR code. Yours sincerely Wellman Rau Senior Manager International Business Dept. Mobile/Wechat/WhatsApp: +86 130 6304 7785 Skype: wellmanrau@yeah.net Email: wellmanrau@yeah.net

Shenzhen HTGD Intelligent Equipment Co., Ltd.

VJE’s Don Naugler and BEST’s Bob Wetterman to Present during Technical Session SMT3 at SMTA International 2013

Industry News | 2013-09-16 14:38:01.0

VJ Electronix, Inc. and BEST, Inc. announce that Don Naugler and Bob Wetterman will be presenting a paper during technical session SMT3 BGA Profiling and Reballing at the upcoming SMTA International in Fort Worth, TX.

VJ Electronix

SMART Group Continues smart-e-webinar Series with Solder Sphere Webinar

Industry News | 2013-07-05 17:24:15.0

SMART Group announces that it will present the webinar “Using Solder Spheres in Fine-Pitch Area-Array Rework Plus Manufacturing Quality Control” on Tuesday 20th August 2013 at 14:30.

The SMART Group

Why use Via in Pad Design?

Industry News | 2019-11-05 22:08:21.0

Via in pad is the design practice of placing a via in the copper landing pad of a component. Compared to standard PCB via routing, via in pad allows a design to use smaller component pitch sizes and further reduce the PCBs overall size. With component manufactures pushing smaller parts every year and the demand from consumers for smaller devices, the usage of via in pad practices by hardware engineers have become more commonplace. In this article, we will discuss the differences between via in pad and traditional vias, when should you use via in pad, and how to design for it.

Headpcb

  1 2 Next

what is a bga pitch searches for Companies, Equipment, Machines, Suppliers & Information