Industry News: whisker mitigation (Page 3 of 7)

INAUGURAL IPC TECHSUMMIT COMBINES THREE IPC CONFERENCES INTO ONE Focus on Innovation, Reliability and Leadership

Industry News | 2014-02-27 16:55:21.0

Combining three events into one, IPC’s inaugural IPC TechSummit™ on October 28–30, 2014, in Raleigh, N.C., will focus on innovation, reliability and leadership — three cornerstones of successful business in today’s electronics marketplace.

Association Connecting Electronics Industries (IPC)

IPC Conference to “Clean Up” Reliability Problems

Industry News | 2013-10-28 16:31:54.0

IPC Conference on Solder and Reliability: Materials, Processes and Tests, November 13–14 in Costa Mesa, Calif.

Association Connecting Electronics Industries (IPC)

IPC Conference on Reliability Highlights New Findings in All Areas of Electronics Assembly

Industry News | 2011-08-24 17:13:21.0

The IPC Conference on Reliability: Assembly Process for a Reliable Product will be held November 1-2, 2011, in Irvine, Calif. The conference will address reliability issues that arise at the assembly level, dedicating half-day programs on new developments in each of three key areas: materials, processes, and test and inspection.

Association Connecting Electronics Industries (IPC)

IPC PERM COUNCIL ADDRESSES LEAD-FREE CONCERNS IN HIGH-RELIABILITY ELECTRONICS

Industry News | 2014-07-23 17:19:28.0

IPC and Celestica announce that the IPC Pb-free Electronics Risk Management (PERM) Council is meeting in Toronto, Canada, July 22–24, to discuss lead-free conversion issues related to the safety, performance, reliability and affordability of electronics in the aerospace, defense, medical and other high-performance markets.

Association Connecting Electronics Industries (IPC)

IPC Releases New IPC/PERM-2901, Pb-free Design and Assembly Implementation Guide IPC-PERM-2901 addresses the impact of Pb-free on reliability and service life for aerospace, defense and high-performa

Industry News | 2018-02-19 13:55:53.0

IPC — Association Connecting Electronics Industries® Pb-free Electronics Risk Management (PERM) Council has developed the first single document dedicated solely to assisting design engineering in the development of electronics that are completely lead-free (Pb-free) and meet the demanding requirements of aerospace, defense and high performance (ADHP) products and systems.

Association Connecting Electronics Industries (IPC)

Circuit Technology Center Partners with Hentec RPS to Provide World-Class Component Modification Services

Industry News | 2022-01-24 18:01:46.0

Available component modification services utilizing Hentec/RPS Odyssey RHSD systems include BGA de-balling, gold mitigation, lead tinning and tin whisker mitigation.

Hentec Industries, Inc. (RPS Automation)

AEM Incorporated Invests in Hentec/RPS Photon Steam Aging System

Industry News | 2021-06-07 11:44:52.0

Photon steam aging system provides accelerated life testing simulating elongated storage conditions for high reliability applications.

Hentec Industries, Inc. (RPS Automation)

JEDEC and IPC Release Tin Whisker Acceptance Testing Standard and Mitigation Practices Guideline

Industry News | 2006-05-04 17:10:10.0

Documents to help manufacturers reduce the risk of tin whiskers in Pb-free products

iNEMI (International Electronics Manufacturing Initiative)

JEDEC and IPC Release Tin Whisker Acceptance Testing Standard and Mitigation Practices Guideline

Industry News | 2006-05-04 17:10:12.0

Documents to help manufacturers reduce the risk of tin whiskers in Pb-free products

iNEMI (International Electronics Manufacturing Initiative)

JEDEC and IPC Release Tin Whisker Acceptance Testing Standard and Mitigation Practices Guideline

Industry News | 2006-05-04 17:10:18.0

Documents to help manufacturers reduce the risk of tin whiskers in Pb-free products

iNEMI (International Electronics Manufacturing Initiative)


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