Industry News | 2014-09-09 21:35:30.0
FCT Assembly today announced plans to exhibit in Booth # I105 at OctoberBest 2014, scheduled to take place Wednesday, October 1, 2014 at Tektronix in Beaverton, OR.
Industry News | 2018-02-14 20:11:16.0
optical control announced today they will display the latest SMD Counting Machine OC-SCAN CCX.3 in booth #2953 at the upcoming IPC APEX Expo, taking place Feb 27-March 1 at the San Diego Convention Center in California.
Industry News | 2019-11-05 22:08:21.0
Via in pad is the design practice of placing a via in the copper landing pad of a component. Compared to standard PCB via routing, via in pad allows a design to use smaller component pitch sizes and further reduce the PCBs overall size. With component manufactures pushing smaller parts every year and the demand from consumers for smaller devices, the usage of via in pad practices by hardware engineers have become more commonplace. In this article, we will discuss the differences between via in pad and traditional vias, when should you use via in pad, and how to design for it.
Industry News | 2017-06-13 20:33:06.0
PDR is pleased to announce the PDR IR-E3M Micro Component/PCB Rework System. In response to customer demands for ultra-precision micro-rework, PDR has taken its popular Focused IR E3 Evolution Series Rework Platform and further enhanced it for extreme micro-rework applications. In addition to general-purpose applications, the IR-E3M’s thermal, mechanical and optical features are all precisely engineered to easily deal with micro components and micro PCBs.
Industry News | 2015-09-01 13:01:04.0
FCT Assembly (www.fctassembly.com), well-known in the electronics assembly industry for its Fine Line Stencil and FCT Solder divisions, will highlight its broad portfolio of products at SMTA International 2015 (www.smta.org/smtai/), as well as take part in the conference program and live process demonstrations on the show floor.
Industry News | 2016-11-02 20:17:42.0
Metcal today announced plans to exhibit at the SMTA LA/Orange County Expo, scheduled to take place Thursday, Nov. 3, 2016 at The Grand Event Center in Long Beach, CA. Company representatives will showcase the Metcal MX-5200 Soldering System and Solder Wire Feeder.
Industry News | 2015-03-10 11:09:24.0
Essemtec AG, the Swiss manufacturer of production systems for electronic assembly and packaging, will exhibit at booth #7.135 at SMT/HYBRID/PACKAGING, scheduled to take place May 5-7, 2015 in Nuremberg. Company representatives will demonstrate the latest generation of Paraquda pick-and-place system and Scorpion dispensing system. Other highlights will be the new SMT storage device Cubus Large and the new highly flexible and cost-effective pick-and-place system Lynx.
Industry News | 2015-04-06 12:41:41.0
Essemtec AG, the Swiss manufacturer of production systems for electronic assembly and packaging, will exhibit at booth #7.135 at SMT/HYBRID/PACKAGING, scheduled to take place May 5-7, 2015 in Nuremberg. Company representatives will demonstrate the latest generation of Paraquda pick-and-place system and Scorpion dispensing system. Other highlights will be the new SMT storage device Cubus Large and the new highly flexible and cost-effective pick-and-place system Lynx.
Industry News | 2018-12-08 03:38:44.0
Lead-Free (Pb-Free) Solder and Composition
Industry News | 2008-04-07 23:18:22.0
MORRISVILLE, NC - March 31, 2008 - Juki Corporation, a world-leading provider of automated assembly products and systems, announces that its OPASS technology won a NPI Award in the Software category. The award was presented to the company during a Monday, March 31, 2008 ceremony that took place in the Mandalay Bay Resort & Convention Center in Las Vegas before the start of APEX 2008. OPASS, which stands for Offset Placement After Solder Screen Printing, was developed to address the problem of solder paste alignment errors.
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