Industry News | 2003-05-02 08:58:57.0
Bob Ferguson has been appointed PWB General Manager, North America.
Industry News | 2013-05-01 12:45:51.0
Held at the Rijckholt Castle and Nordson ASYMTEK European Headquarters in Maastricht
Industry News | 2011-01-12 17:40:04.0
Check out these Show Highlights, Ways to Save, Networking and Educational Opportunities, and Exhibition Preview.
Industry News | 2018-03-13 18:47:01.0
TopLine will once again be the premier sponsor of the upcoming IMAPS Wire Bonding Conference. In making the announcement, TopLine CEO Martin Hart stated that he is delighted to support the conference as the leading sponsor for the second time. The Wire Bonding workshop and tabletop exhibition will be held October 8, 2018 in California at the Pasadena Convention Center. The event is co-located with the IMAPS 51st Symposium on Microelectronics.
Industry News | 2018-09-18 19:55:05.0
NEO Tech announces that it received reaccreditation by the Department of Defense, Defense Microelectronics Activity (DMEA), furthering its reputation as a leader in the microelectronics industry.
Industry News | 2024-11-25 14:37:59.0
NEOTech proudly announces a major advancement in its wire bond pull testing process, reducing manufacturing cycle time by more than 60% while maintaining industry-leading production yields of over 99.99%. This improvement reflects NEOTech's commitment to continuous process enhancement and operational excellence.
Industry News | 2017-07-07 18:49:14.0
Carlsbad, CA. July 10, 2017: Machine Vision Products today announced the appointment of Paul Groome as their manager for the world-wide semiconductor business. The recruitment is part of Machine Vision Products on going strategic plans to improve customer contact and raise market awareness of their industry leading microelectronics, wire bond, semiconductor and packaging Inspection products
Industry News | 2003-05-05 09:13:55.0
Reliable Wire Bonders for High Yield Production
Industry News | 2024-10-06 19:41:20.0
NEOTech is excited to announce the recent implementation of an enhanced wire bonding manufacturing process for microelectronics circuit assemblies. This innovative process significantly increases production yields while reducing the production cycle time for each assembly. NEOTech remains committed to continuous improvements, particularly in the manufacturing of extraordinarily high-tech microelectronics products for the nation's leading OEMs in the Aerospace & Defense, Medical Device, and Industrial markets. As part of this commitment, NEOTech has researched, tested, and qualified an advanced wire bonding technique known as Standoff Stitch (SOS), which further reinforces the company's dedication to delivering high-quality, precision-driven solutions.
Industry News | 2015-06-18 17:55:13.0
Indium Corporation and the Empire Chapter of the International Microelectronics Assembly and Packaging Society (IMAPS), in association with the State University of New York (SUNY), will host an Advanced Technology Workshop and Tabletop Exhibition on Advances in Semiconductor Packaging on Sept. 24 at SUNY Polytechnic Institute in Marcy, N.Y.
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