Industry News | 2019-01-17 20:36:59.0
MIRTEC, ‘The Global Leader in Inspection Technology’, is pleased to announce the appointment of Kirby & Demarest as its manufacturers’ representative. Kirby & Demarest will provide sales and support for MIRTEC’s award-winning inspection systems in Oregon, Washington, Idaho, Montana and the Province of British Columbia. The rep firm provides high technology companies an array of products utilized in the design, manufacturer and test of circuit board assemblies, hybrid circuits, and semiconductors.
Industry News | 2003-05-02 08:58:57.0
Bob Ferguson has been appointed PWB General Manager, North America.
Industry News | 2015-06-11 16:02:18.0
MIRTEC, "The Global Leader in Inspection Technology," will exhibit its most recent solutions for System in Package (SiP) inspection and measurement at SEMICON WEST 2015; July 14-16, 2015, at the Moscone Center in San Francisco, CA. Visitors are invited to booth # 2343 for a detailed demonstration of this exciting new technology.
Industry News | 2015-05-07 19:28:29.0
MIRTEC announce a new strategic cooperation that will empower yield improvement in the electronics manufacturing industry.
Industry News | 2013-05-01 12:45:51.0
Held at the Rijckholt Castle and Nordson ASYMTEK European Headquarters in Maastricht
Industry News | 2011-01-12 17:40:04.0
Check out these Show Highlights, Ways to Save, Networking and Educational Opportunities, and Exhibition Preview.
Industry News | 2023-05-15 17:38:25.0
IPC and the International Microelectronics Assembly and Packaging Society (IMAPS) will host an "On-Shoring Advanced Packaging and Assembly," workshop July 10-12, 2023, in Washington, D.C.
Industry News | 2024-03-11 15:00:03.0
Connect with our experts and see plasma and dispensing equipment for microelectronics manufacturing in booth 3645
Industry News | 2018-03-13 18:47:01.0
TopLine will once again be the premier sponsor of the upcoming IMAPS Wire Bonding Conference. In making the announcement, TopLine CEO Martin Hart stated that he is delighted to support the conference as the leading sponsor for the second time. The Wire Bonding workshop and tabletop exhibition will be held October 8, 2018 in California at the Pasadena Convention Center. The event is co-located with the IMAPS 51st Symposium on Microelectronics.
Industry News | 2018-09-18 19:55:05.0
NEO Tech announces that it received reaccreditation by the Department of Defense, Defense Microelectronics Activity (DMEA), furthering its reputation as a leader in the microelectronics industry.
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