Industry News | 2011-08-24 22:37:23.0
The SMTA announced that it will hold sessions and a tutorial on Package-on-Package (PoP) surface mount stacking at their annual conference, SMTA International, taking place October 16-20, 2011 in Ft. Worth, Texas.
Industry News | 2003-05-21 08:13:48.0
Two half-day workshops on Thursday during SMTA
Industry News | 2013-02-20 18:54:10.0
IPC — Association Connecting Electronics Industries® presented Committee Leadership, Distinguished Committee Service and Special Recognition Awards at IPC APEX EXPO® at the San Diego Convention Center.
Industry News | 2019-11-05 22:19:03.0
> News-Blog > Guideline for wire bonding Guideline for wire bonding Tuesday,Jun 12,2018 There are two wire bonding processes that are used, Thermosonic (T/S) Gold Ball Wire Bonding and Ultrasonic (U/S) Aluminum Wedge Wire Bonding. Approximately 90% of all IC Assembly in Semiconductor Packages is manufactured using Gold Ball Bonding process, while Aluminum Wedge Bonding is used to produce about 10% of other Wire Bonding requirements on Printed Circuit Boards (PCB), Printed Circuit Flex (PCF) and other Packages.
Industry News | 2017-10-05 19:30:49.0
Nordson MARCH will present the paper, Enhancing the Performance of Printed Circuit Board Assemblies Using Plasma Treatment, at SMTA Guadalajara 2017. David Foote, Global Applications Manager, Nordson MARCH, will discuss the fundamentals of plasma treatment. Specific applications and examples will be shown to demonstrate the many uses and benefits of plasma processing for printed circuit board assemblies (PCBAs), including managing electrostatic discharge (ESD) damage.
Industry News | 2012-09-10 09:15:27.0
MARTIN will be one of nine companies participating in the Package on Package Design and Assembly Center (PoP Center) at SMTA International this year.
Industry News | 2012-07-06 19:44:05.0
Carlsbad, CA– July 6, 2012: Machine Vision Products today announced it would be demonstrating the diverse inspection toolbox of the Ultra 850G Microelectronics and Packaging AOI solution at the Semicon West 2012 exhibition. The exhibition is at the Moscone Center in San Francisco from July 10-12 2012. Machine Vision Products are exhibiting at booth #6383 in the North Hall.
Industry News | 2012-07-06 19:44:43.0
Carlsbad, CA– July 6, 2012: Machine Vision Products today announced it would be demonstrating the diverse inspection toolbox of the Ultra 850G Microelectronics and Packaging AOI solution at the Semicon West 2012 exhibition. The exhibition is at the Moscone Center in San Francisco from July 10-12 2012. Machine Vision Products are exhibiting at booth #6383 in the North Hall.
Industry News | 2012-07-06 19:44:24.0
Carlsbad, CA– July 6, 2012: Machine Vision Products today announced it would be demonstrating the diverse inspection toolbox of the Ultra 850G Microelectronics and Packaging AOI solution at the Semicon West 2012 exhibition. The exhibition is at the Moscone Center in San Francisco from July 10-12 2012. Machine Vision Products are exhibiting at booth #6383 in the North Hall.
Industry News | 2017-10-18 20:31:57.0
YXLON International is pleased to announce that Keith Bryant, Global Direcompany of the Swiss tech holding, Comet Grouptor Electronics Sales, has been selected to present during productronica Messe München in Germany. Bryant will speak during the SMTA Technical Program in the SMT Speakers Corner (A1.220) on Thursday, Nov. 16, 2017 from 1-1:30 p.m. The presentation will look at the advantages that cross over X-ray systems, like the YXLON FF35 CT, bring to CT imaging in electronics failure analysis and in-depth fault finding. Bryant will discuss the latest technologies and show stunning reconstructions.
COT specializes in high quality SMT nozzles and consumables for pick and place machines. We provide special engineering design service of custom nozzles for those unique and odd components.
2481 Hilton Drive
Gainesville, GA USA
Phone: (770) 538-0411
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