Industry News | 2018-12-08 03:38:44.0
Lead-Free (Pb-Free) Solder and Composition
Industry News | 2024-09-30 19:43:24.0
Stannol is pleased to announce its participation in SMTA International 2024, where the company will showcase its latest advancements in soldering technology at Booth 2863. The event is scheduled to take place Oct. 21-24, 2024 at the Donald E. Stephens Convention Center in Rosemont, Illinois. Attendees will have the opportunity to explore Stannol's cutting-edge products designed to enhance performance and sustainability in the soldering industry.
Industry News | 2016-05-21 07:36:35.0
SHENMAO Bumping Solder Paste PF608-PI-21 (Sn/Ag4.0/Cu0.5/x) and PF606-P-BS1 (Sn/Ag3.0/Cu0.5/x) aim to decrease voids in wafer bumping process. SHENMAO MICRO MATERIAL INSTITUTE applications engineers focused on developing the Bumping Solder Paste Formula with excellent stencil printing transfer rate and the lowest Void to optimize manufacturing process performance. The world’s largest IC Packaging and Test Service OSAT utilize SHENMAO Bumping Solder Paste in production.
Industry News | 2016-07-07 14:47:47.0
SHENMAO Bumping Solder Paste PF608-PI-21 (Sn/Ag4.0/Cu0.5/x) and PF606-P-BS1 (Sn/Ag3.0/Cu0.5/x) aim to decrease voids in wafer bumping process. SHENMAO MICRO MATERIAL INSTITUTE applications engineers focused on developing the Bumping Solder Paste Formula with excellent stencil printing transfer rate and the lowest Void to optimize manufacturing process performance. The world’s largest IC Packaging and Test Service OSAT utilize SHENMAO Bumping Solder Paste in production.
Industry News | 2015-10-13 19:27:42.0
SHENMAO Bumping Solder Paste PF608-PI-21 (Sn/Ag4.0/Cu0.5/x) and PF606-P-BS1 (Sn/Ag3.0/Cu0.5/x) aim to decrease voids in wafer bumping process. SHENMAO MICRO MATERIAL INSTITUTE applications engineers focused on developing the Bumping Solder Paste Formula with excellent stencil printing transfer rate and the lowest Void (
Industry News | 2022-01-29 13:28:14.0
Indium Corporation has expanded its manufacturing capabilities to include a fine diameter 0.004" (0.10mm) flux-cored wire made with select Pb-free alloys to help customers meet the progressively demanding requirements of fine-pitch applications.
Industry News | 2009-12-07 17:55:23.0
BALVE, GERMANY — November 2009 — The BALVER ZINN Group, a leading provider of high-quality alloyed solder anodes, as well as special cored and solid wires, will demonstrate the new i-SAC series of optimized Alloyed Lead-Free Solders in Hall A4, Stand 570 of the upcoming Productronica exhibition - scheduled to take place 10th – 13th November 2009 at the New Munich Trade Fair Center in Munich, Germany.
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