Industry News: wlcsp (Page 1 of 3)

SMTA South East Asia Technical Conference on Electronics Assembly Program Finalized

Industry News | 2018-03-13 18:51:40.0

SMTA is excited to announce the technical program has been finalized and registration is now open for the South East Asia Technical Conference on Electronics Assembly. The event will be held May 8-10, 2018 at the MITEC in Kuala Lumpur, Malaysia.

Surface Mount Technology Association (SMTA)

SMTA International Call for Papers - Deadline Approaches

Industry News | 2003-02-18 09:39:06.0

Encourages You to Submit an Abstract for this Year's Conference

Surface Mount Technology Association (SMTA)

SMTA South East Asia Technical Conference on Electronics Assembly Technologies Call for Presentations Announced

Industry News | 2009-04-23 20:54:01.0

MINNEAPOLIS, MN � The SMTA is pleased to announce its latest technical event in Penang, Malaysia. The SMTA South East Asia Technical Conference on Electronics Assembly Technologies will be held November 19-20, 2009 at the Equatorial Hotel in Penang, Malaysia. Presentations are currently being solicited for the following key technology tracks:

Surface Mount Technology Association (SMTA)

International Wafer-Level Packaging Conference (IWLPC) Concludes on a Positive Note

Industry News | 2009-11-06 17:10:00.0

Minneapolis, MN - The SMTA and Chip Scale Review magazine are pleased to announce the the 6th Annual International Wafer-Level Packaging Conference and Exhibition was a resounding success. The IWLPC was held October 27-30, 2009 at the Marriott Hotel in Santa Clara, California.

Surface Mount Technology Association (SMTA)

IWLPC Best Papers Announced

Industry News | 2015-01-15 19:44:09.0

SMTA and Chip Scale Review magazine announced the best papers from the 2014 International Wafer-Level Packaging Conference (IWLPC.) Winners were selected from each of the three tracks covering Wafer Level Packaging, 3-D (Stacked) Packaging, and MEMS Packaging, as well as an overall Best Paper and Best of Conference winner. IWLPC brings together some of the semiconductor industry's most respected authorities addressing all aspects of wafer-level, 3D, TSV, and MEMS device packaging.

Surface Mount Technology Association (SMTA)

SMTAI 2009 Call For Papers Reminder

Industry News | 2009-01-23 19:18:23.0

You are invited to submit a paper to the electronic industry's premier forum on the manufacture of electronic products utilizing surface mount and related technologies.

Surface Mount Technology Association (SMTA)

GHz Bandwidth Socket for Dual WLCSP

Industry News | 2011-02-26 14:35:16.0

Ironwood Electronics has recently introduced a new high performance WLCSP socket for 0.5mm pitch 40 ball WLCSP and 0.4mm pitch 30 ball WLCSP accommodated in the same socket.

Ironwood Electronics

Multitest's Mercury™ Contactor: Outstanding Lifetime for WLSCP Test

Industry News | 2011-06-16 14:55:16.0

Multitest announces that its installed base of WLCSP contactors is steadily growing. The contactors are running high-volume production at subcontractors in China, Taiwan, Singapore and other locations. They show outstanding lifetime performance, contributing to unreached cost of test.

Multitest Elektronische Systeme GmbH

Multitest’s Mercury Contactors for Wafer-Level Test Successfully Deployed to Subcontractors in Asia

Industry News | 2011-03-10 20:49:13.0

Multitest announces that another major fabless semiconductor manufacturer has evaluated and approved its Mercury-based wafer-level contactors. These Mercury contactors have eight sites and more than spring probes per site.

Multitest Elektronische Systeme GmbH

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