Industry News | 2011-12-14 15:35:33.0
Manufacturing processes, handling and printed circuit assembly (PCA) test can put a lot of mechanical stresses on packages, causing failures. As grid array packages get larger, identifying how to set safe levels for these steps becomes more difficult. A new quantitative test methodology within IPC/JEDEC-9707, Spherical Bend Test Method for Characterization of Board Level Interconnects, lets users determine how much strain packages can take before reliability degradation.
Industry News | 2010-06-11 15:59:00.0
BANNOCKBURN, IL — IPC — Association Connecting Electronics Industries® has released the A revision of IPC-9592, Requirements for Power Conversion Devices for the Computer and Telecommunications Industries. First released in 2008, IPC-9592 sets the requirements for power conversion devices (PCDs) in the computer and telecommunications industries, including design for reliability, design qualification testing, manufacturing conformance testing and quality processes.
Industry News | 2012-01-03 10:40:18.0
Technic has announced the release of Technic EN AT5600, an electroless nickel developed specifically to eliminate black pad and to improve soldering on ENIG coated PCBs. Technic EN AT 5600 is the first electroless nickel that provides lateral growth on copper, yielding a flatter surface with less pronounced grain boundaries instead of the typical nodular, "cauliflower-like" structure from older formulas.
Industry News | 2012-12-19 12:15:55.0
Multitest, is proud to present a paper during the European 3D TSV Summit (Grenoble - Jan 22-23, 2013).
Industry News | 2020-03-25 15:38:54.0
Royal Flex Circuits is Increasing Production Hours and Adding Shifts to Meet Demand
Industry News | 2008-01-28 23:23:03.0
New Instrument Class Offers Most Accurate and Accelerated Insight into Devices and Designs, Enables Quantum Leap in Productivity
Industry News | 2018-09-20 10:59:07.0
Emission-free, fully autonomous and networked throughout the entire world as well – that’s more or less what the car of the future will look like. Thanks to rapid progress in the field of electronics, the vision of fully autonomous vehicles – something that seemed inconceivable just a few years ago – is now within our reach.
Industry News | 2006-06-23 16:19:47.0
Group Addresses Assembly Process and Reliability Requirements for SnPb and Pb-free Modules
Industry News | 2018-08-29 08:53:33.0
Modern dispensing technology protects the electronics in vehicles from moisture, dust and extreme temperatures. NEUSTADT/DONAU. It runs with no emissions, it’s completely autonomous and, what’s more, it’s networked with the entire world – this is what the car of the future will look like. Thanks to rapid advances in the field of electronics, the vision of a (fully) autonomous vehicle, which appeared unrealistic just a few years ago, is now within reach.
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