Industry News: worst case (Page 1 of 2)

How Much Strain Can a Package Take?

Industry News | 2011-12-14 15:35:33.0

Manufacturing processes, handling and printed circuit assembly (PCA) test can put a lot of mechanical stresses on packages, causing failures. As grid array packages get larger, identifying how to set safe levels for these steps becomes more difficult. A new quantitative test methodology within IPC/JEDEC-9707, Spherical Bend Test Method for Characterization of Board Level Interconnects, lets users determine how much strain packages can take before reliability degradation.

Association Connecting Electronics Industries (IPC)

First-Ever Power Conversion Standard IPC-9592 Gets Update

Industry News | 2010-06-11 15:59:00.0

BANNOCKBURN, IL — IPC — Association Connecting Electronics Industries® has released the A revision of IPC-9592, Requirements for Power Conversion Devices for the Computer and Telecommunications Industries. First released in 2008, IPC-9592 sets the requirements for power conversion devices (PCDs) in the computer and telecommunications industries, including design for reliability, design qualification testing, manufacturing conformance testing and quality processes.

Association Connecting Electronics Industries (IPC)

ZESTRON will be Presenting at the SMTA International Expo

Industry News | 2022-10-20 06:51:24.0

ZESTRON is pleased to announce that the ZESTRON Americas team will be presenting at the SMTA International Expo & Tech Forum.

3M Electrical Solutions Division

Technic Releases Black Pad Resistant Electroless Nickel

Industry News | 2012-01-03 10:40:18.0

Technic has announced the release of Technic EN AT5600, an electroless nickel developed specifically to eliminate black pad and to improve soldering on ENIG coated PCBs. Technic EN AT 5600 is the first electroless nickel that provides lateral growth on copper, yielding a flatter surface with less pronounced grain boundaries instead of the typical nodular, "cauliflower-like" structure from older formulas.

Technic Inc.

ZESTRON Offers Free Webinar on Advancements in Solder Paste Printing

Industry News | 2024-05-13 10:16:58.0

ZESTRON is pleased to announce an upcoming webinar titled "Advancements in Solder Paste Printing: Cleaning Compatibility of Jettable and Screen-Printable Solder Pastes in Advanced Electronic Assemblies," scheduled for May 16, 2024, at 2:00 PM EDT.

3M Electrical Solutions Division

EUROPEAN 3D TSV SUMMIT: Join the Presentation by Multitest Experts

Industry News | 2012-12-19 12:15:55.0

Multitest, is proud to present a paper during the European 3D TSV Summit (Grenoble - Jan 22-23, 2013).

Multitest Elektronische Systeme GmbH

Southern California PCB Manufacturer Working Hard to Support Production of Ventilators

Industry News | 2020-03-25 15:38:54.0

Royal Flex Circuits is Increasing Production Hours and Adding Shifts to Meet Demand

Royal Circuit Solutions, Inc.

Agilent Technologies Introduces Industry's First Pulse Function Arbitrary Noise Generator

Industry News | 2008-01-28 23:23:03.0

New Instrument Class Offers Most Accurate and Accelerated Insight into Devices and Designs, Enables Quantum Leap in Productivity

Agilent Technologies, Inc.

In the midst of change - E-Mobility

Industry News | 2018-09-20 10:59:07.0

Emission-free, fully autonomous and networked throughout the entire world as well – that’s more or less what the car of the future will look like. Thanks to rapid progress in the field of electronics, the vision of fully autonomous vehicles – something that seemed inconceivable just a few years ago – is now within our reach.

Scheugenpflug Inc.

iNEMI Publishes Guidelines for Subassemblies in High-Reliability Applications

Industry News | 2006-06-23 16:19:47.0

Group Addresses Assembly Process and Reliability Requirements for SnPb and Pb-free Modules

iNEMI (International Electronics Manufacturing Initiative)

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