Industry News: ws609 flux residue (Page 8 of 65)

Kyzen’s Mike Bixenman to Present OA Flux Cleaning Studies at APEX 2010

Industry News | 2010-03-30 13:55:49.0

NASHVILLE - Kyzen, the world leading provider of environmentally responsible precision cleaning products for electronics and high-technology manufacturing operations, announces that Dr. Mike Bixenman will present a paper titled "OA Flux Cleaning Studies on Highly Dense Advanced Packages Parameters" at the upcoming IPC/APEX conference and exhibition.

KYZEN Corporation

YINCAE Advanced Materials to Exhibit and Present at IMAPS New England Symposium & Expo 2019

Industry News | 2019-03-12 08:54:28.0

(Albany, NY) March 12, 2019 YINCAE Advanced Materials is proud to announce that we will be exhibiting at this year’s IMAPS New England Symposium & Expo 2019, at the Boxboro Regency Hotel & Conference Center, in Boxborough, MA. Additionally, Dr. Wusheng Yin, President of YINCAE, will be giving a presentation on our unique product, Zero Outgassing and Flux Residue-compatible Underfill.

YINCAE Advanced Materials, LLC.

AIM Solder Announces the Release of NC277 VOC-free Liquid Flux

Industry News | 2013-05-13 15:06:06.0

AIM Solder, announces that NC277 is a VOC-free liquid flux that is as electrically safe as an alcohol-based flux and has a medium residue that is suitable for long thermal demands. Winner of a 2013 NPI Award from Circuits Assembly, this halide-free, environmentally safe liquid flux has upon introduction been recognized for exceeding industry standards.

AIM Solder

Indium Corporation Honored with Two Global Technology Awards at Productronica

Industry News | 2023-11-20 15:34:41.0

Indium Corporation was honored with two prestigious GLOBAL Technology Awards during an awards ceremony on November 14 at Productronica in Munich, Germany. The company was honored in both the Flux and Adhesives/Underfills Encapsulants categories for NC-809, a halogen-free, ultra-low residue flip-chip flux, and InTACK™, a drop-in, robust tacking agent for power module assembly, respectively. Presented by Global SMT & Packaging, the Global Technology Awards recognize the best new innovations in the printed circuit assembly and packaging industries introduced in the past 12 months.

Indium Corporation

Kester Launches NF372-TB Flux-Pen® and RF550 Rework Flux

Industry News | 2016-04-28 17:33:05.0

Kester is proud to announce the launch of NF372-TB Flux-Pen® and RF550 Rework Flux. These products were formulated to compliment Kester’s high-reliability, no-clean product line.

Kester

Ersa to Offer VOC-free Fluxes from Interflux as Alcohol Supplies Get Diverted to Fight Pandemic

Industry News | 2020-04-18 13:46:46.0

Kurtz Ersa Inc. is pleased to announce that it is offering Interflux's SelectIF 2040 and PacIFic 2009M VOC-free fluxes. Due to the recent demand for isopropyl alcohol, many companies are changing to water-based (VOC-free) fluxes instead of alcohol-based fluxes for their selective soldering and wave soldering processes.

kurtz ersa Corporation

SHENMAO Offers Enhanced Solder Joint Encapsulation Material Flux

Industry News | 2022-06-24 10:13:15.0

SHENMAO America, Inc. is pleased to offer its enhanced Solder Joint Encapsulation Material (SJEM) SMEF-Z52 Flux. The SJEM Flux combines the abilities of conventional flux and underfill. The epoxy cures after reflow and provides excellent bonding strength and joint protection. Joint reliability performance is elevated as well.

Shenmao Technology Inc.

The Balver Zinn Group to Exhibit a Host of Solder Materials at SMT Nuremberg 2015

Industry News | 2015-04-21 16:57:06.0

The Balver Zinn Group announces that they will be attending SMT/Hybrid/Packaging 2015 scheduled to take place May 5-7 in Nuremberg, Germany. They will highlight the company’s latest solder flux and paste technology in Booth #7-308.

Balver Zinn

KYZEN’s Dr. Mike to Present No-Clean Flux Residue Study Findings at SMTAI

Industry News | 2016-09-07 18:44:03.0

KYZEN announces that Dr. Mike Bixenman will present the recent paper entitled, “Reactivity of No-Clean Flux Residues Trapped Under Bottom Terminated Components” during SMTA International. The paper is co-authored by Bruno Tolla, Ph.D., Jennifer Allen and Kyle Loomis from Kester and will be presented during the “Flux, Solder, Adhesives Track” on Tuesday, September 27, 2016 at 3 p.m.

KYZEN Corporation

Indium Corporation's Lim to Present at SEMICON China

Industry News | 2016-03-03 10:33:15.0

Indium Corporation's Sze Pei Lim, Semiconductor Product Manager for Asia, will present at SEMICON China. Lim's presentation, No-Clean Material for Advanced Packaging Assembly, will detail how semiconductor-grade, ultra-low residue, no-clean fluxes and solder pastes eliminate the need for multiple cleaning steps in the system-in-package (SiP) assembly process.

Indium Corporation


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