Industry News | 2009-05-29 12:27:20.0
Technology leader Siemens Electronics Assembly Systems (SEAS) unveils the new combined die-bonding and SMD placement application SIPLACE CA. Based on the SIPLACE X-series platform, it is the world's first machine that combines the highest of SMD placement speed with the extreme precision of die-bonding.
Industry News | 2009-03-10 00:30:31.0
Siemens Electronics Assembly Systems will introduce the Siplace X-Series powered by the new Siplace CPP MultiStar placement head at APEX 2009 in Booth #1458. The new Siplace X-Series powered by Siplace MultiStar delivers the ideal combination of chip shooting speed along with extensive component range capability required for flexible end of line placement. This �all-in-one� solution, called Collect & Pick & Place (CPP) enables electronics manufacturers to simplify line setup and programming, eliminate the need for line reconfiguration or head changes, and ensures optimal line balancing for higher productivity and lower operational costs.
Industry News | 2009-03-19 15:44:30.0
With its SIPLACE MultiStar, Siemens Electronics Assembly Systems presents the world's first placement head that automatically adapts to nearly all requirements and products in electronics manufacturing. By using different placement modes, the SIPLACE MultiStar balances production lines automatically. It is the first head that combines the speed of Collect & Place operation for small components (01005 and larger) with the versatility of Pick & Place operation for larger components (up to 50 x 40 mm).
Industry News | 2010-11-16 12:27:02.0
Turck Deléémont is investing in two state-of-the-art SIPLACE machines from the successful X-Series to get ready for the rising order volume at its location in Delémont, Switzerland.
Industry News | 2009-05-29 12:32:19.0
SIPLACE reference lines equipped with the new MultiStar CPP head deliver a continuous high level of line productivity, especially in high-mix production environments.
Industry News | 2013-05-22 11:40:13.0
With its brand-new SIPLACE Di-Series the SIPLACE team of ASM Assembly Systems now offers proven placement quality and maximum process reliability in combination with innovative software also in the low-price segment. Technological details which are rare in this segment, such as digital vision systems, single and dual conveyors and modern, multi-language station software, are standard features on the SIPLACE Di-Series. Available in versions with one, two and four gantries, the SIPLACE D1i, SIPLACE D2i and SIPLACE D4i guarantee quick and smart new product introductions as well as fast and accurate placement capabilities - down to 01005 components.
Industry News | 2006-02-23 10:25:26.0
The placement machine platform from Siemens Electronics Assembly Systems - the SIPLACE X-Series - was recognized by SMT magazine for innovation and excellence at the APEX/IPC Printed Circuits Expo.
Industry News | 2014-09-06 15:42:26.0
PARMI announces the Jet Solder Jet Dispenser Unit for its award-winning SIGMA X SPI Series. Jet repairs solder paste deposits within the machine to eliminate expensive rework and scrap, maximizes throughput and increases ROI.
Industry News | 2009-05-06 14:53:51.0
With the SIPLACE SX, Munich-based technology leader Siemens Electronics Assembly Systems (SEAS) introduces a placement machine that opens the door to totally new manufacturing concepts and delivers significantly more efficiency in response to increasingly frequent product changeovers and massive demand fluctuations.
Industry News | 2013-02-25 18:32:14.0
Equipment Services, LLC has introduced a new line of ESE US-X Series solder-paste printers to the North American PCB assembly market. The advanced-technology SMT screen printers, which feature 2-D solder-paste inspection as standard, are built in Korea to the highest level of quality.
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