Industry News | 2003-06-10 08:39:25.0
New from Unitek Eapro is a series of desktop systems for hot bar bonding applications.
Industry News | 2003-03-14 09:03:48.0
Sarantel has developed a surface-mount version of its active GeoHelix miniature GPS antenna.
Industry News | 2022-05-27 14:34:04.0
From battery fires to non-functional charging stations, from dendrites to poor cable connections, electronic system failures have caused massive recalls. Failures are increasing significantly, not because of quality, but because of usage and implementation of technology. As the expected lifetime usage of parts increases and technology applications change, materials, approaches, and test parameters must change as well.
Industry News | 2011-11-11 14:38:51.0
Want to get a handle on commonly used electronics industry acronyms and terminology? Look no further than the definitive resource, IPC-T-50J, Terms and Definitions for Interconnecting and Packaging Electronic Circuits. Recently released by IPC, the J revision of IPC-T-50 contains nearly 400 new or revised terms, including terminology for chip scale and area array packaging, cable and wire harness technology, semiconductor packaging, assembly processing, moisture sensitive components and microvia technology.
Industry News | 2010-09-26 14:42:22.0
Extending its training and knowledge-based resources and services to Indian electronics manufacturing facilities on a local level, IPC — Association Connecting Electronics Industries® has opened its first office in India. Located in South Bangalore, close to the well-known Electronics City, IPC India, a wholly-owned subsidiary of IPC, will be under the leadership of Managing Director Mr. Akshinthala Vijayendra.
Industry News | 2013-06-10 08:43:59.0
Juki Automation Systems, announces that Carolina Electronic Assemblers, Inc. (CEA) recently purchased a FX-3 XL/KE-3020 large board line.
Industry News | 2013-09-10 10:16:57.0
With the help of crimping equipment from Schleuniger, JumperZ Audio is able to achieve a high-quality cable every time.
Industry News | 2007-10-29 22:33:48.0
Agilent Technologies Inc. (NYSE: A) today announced the industry's first probing solution for making oscilloscope measurements in environmental chambers and in other settings with extreme temperature conditions.
Industry News | 2014-08-16 17:55:06.0
Toddco General, Inc. released the new TG-1000 bonding platform to easily support large display panels or other substrates requiring hot bar bonding of flexible circuits, TABs, COF or COG. Designed for process development labs, high-mix production or repair environments.
