Industry News: y axis card (Page 24 of 25)

Aegis Software Enables Paperless Defect Mapping at Sechan Electronics

Industry News | 2012-10-26 07:25:39.0

Sechan Electronics, Inc.relationship with Aegis Software extends back over 11 years, beginning with their initial purchase of CircuitCAM and CheckPoint; software modules that are now integrated into iLaunch.

Aegis Industrial Software Corporation

Aegis Software Enables Paperless Defect Mapping at Sechan Electronics

Industry News | 2012-10-27 01:42:15.0

Sechan Electronics is an established contract manufacturing services company committed to developing, testing and manufacturing military electronics systems and subsystems for the Department of Defense and Prime Contractors. Sechan’s relationship with Aegis Software extends back over 11 years, beginning with their initial purchase of CircuitCAM and CheckPoint; software modules that are now integrated into iLaunch.

Aegis Industrial Software Corporation

ADLINK CoreModule® 920 with 3rd Generation Intel® Core™ Processor Delivering Highest Performance at Low Power

Industry News | 2013-03-13 13:36:45.0

ADLINK Technology releases its newest Extreme Rugged™ CoreModule® offering. The ADLINK CoreModule® 920, with outstanding mechanical, thermal and power design, is able to support Intel® Core™ i7 performance with low power consumption in a small PC/104 form factor, making it an ideal choice for mission-critical applications in space-constrained environments such as transportation, aviation and defense/homeland security.

ADLINK Technology, Inc.

ADLINK Premieres Industrial Server-Grade System With Refreshed Intel® Xeon® E5-2600 v2

Industry News | 2014-02-05 11:04:13.0

ADLINK Technology announced its new 4U server-grade industrial system, the TRL-40, based on the Intel® Xeon® Processor E5-2600 product family and delivering a scalable high performance platform for a wide array of industrial applications.

ADLINK Technology, Inc.

ADLINK Announces Compact COM Express® Type 6 Module Featuring High Performance and Ultra-Low Power Consumption

Industry News | 2014-02-20 20:04:17.0

Embedded systems in the areas of medical, digital signage, gaming, video conferencing and industrial automation need outstanding CPU and graphics performance but are constrained by either size or thermal management. ADLINK Technology's new offering, the cExpress-HL COM Express® Type 6 Compact size computer-on-module (COM), takes full advantage of the Mobile 4th Generation Intel® Core™ Processor (formerly known as "Haswell-ULT") to provide a compact, high-performance COM solution with outstanding graphics capabilities.

ADLINK Technology, Inc.

ADLINK Introduces Feature-Rich COM Express® Module with 4th Generation Intel® Core™ Processor

Industry News | 2014-04-01 19:35:47.0

ADLINK Technology rolled out its most advanced COM Express® Type 6 module, adopting the 4th generation Intel® Core™ processor (formerly codenamed Haswell) and delivering breakthrough CPU performance, stunning graphics, and improved security functions. The ADLINK Express-HL is among the first products in an array of industrial embedded systems delivering the computing power of Intel’s newest generation Core processor family.

ADLINK Technology, Inc.

ADLINK Launches Extreme Rugged™ HPERC-IBR for Reduced SWaP Requirements

Industry News | 2014-04-01 20:01:42.0

ADLINK Technology announced release of the new Extreme Rugged™ HPERC-IBR system. The HPERC™ (High Performance Extreme Rugged Computer) Series offers a compact, highly reliable and efficient processing unit to meet challenging SWaP (Size, Weight and Power) requirements for modern ground and aerial vehicle applications. HPERC offers one of the first product implementations of the VITA-75 standard to address commercial off-the-shelf (COTS) requirements for Unmanned Ground Vehicle (UGV) applications.

ADLINK Technology, Inc.

ADLINK Introduces its New IMX-3000 Industrial Mobile Computer

Industry News | 2014-05-08 17:41:15.0

ADLINK Technology releases the IMX-3000, its newest industrial mobile computer, a clear choice for a variety of industrial applications, featuring the Android 4.0 operating system and a compact housing for easy transport. The IMX-3000 is perfect for use in retail channels, logistics, on-site inspection, warehousing, transportation, and many other environments.

ADLINK Technology, Inc.

Press preview for Seica Inc. participation at Semicon West, July 10-12 2018, Booth 509, San Francisco, CA.

Industry News | 2018-06-24 07:46:24.0

series, the most versatile and performing flying probe system in the world, which represent yet another outstanding technological leap forward in Seica’s continuous “road” to innovation. This time it will be managed by Viva Next> 6, Seica’s latest evolution of its core management software platform, in a 64 bit version complete with a new graphical interface and a guided environment for creating test programs according to each specific requirement. The new platform continues to leverage its open architecture, further extending the capability of integration with third party software, such as TestStandTM, leaving programmers complete freedom to combine test sequences developed using various platforms in the same test program. In addition to the Seica OEM products described below Seica will also exhibit semiconductor solutions from Crea, OSAI and Microtest.

SEICA SpA

Seica Inc. participation at Semicon West, July 10-12 2018, Booth 509, San Francisco, CA.

Industry News | 2018-07-02 21:34:21.0

series, the most versatile and performing flying probe system in the world, which represent yet another outstanding technological leap forward in Seica’s continuous “road” to innovation. This time it will be managed by Viva Next> 6, Seica’s latest evolution of its core management software platform, in a 64 bit version complete with a new graphical interface and a guided environment for creating test programs according to each specific requirement. The new platform continues to leverage its open architecture, further extending the capability of integration with third party software, such as TestStandTM, leaving programmers complete freedom to combine test sequences developed using various platforms in the same test program. In addition to the Seica OEM products described below Seica will also exhibit semiconductor solutions from Crea, OSAI and Microtest.

SEICA SpA


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