Industry News | 2017-01-17 15:27:24.0
Eunil will exhibit in Booth #101 at the upcoming IPC APEX Expo, scheduled to take place February 14-16 in San Diego, Calif. Eunil will exhibit its ELM-800 Laser Marker, ECM-1100 Coating Master, conveyors, and buffers.
Industry News | 2019-04-14 19:40:43.0
Anda Technologies is pleased to announce they will be exhibiting in Hall 4, booth 520 at the upcoming SMTconnect Expo, scheduled to take place May 7-9 at the Messe in Nuremberg, Germany.
Industry News | 2024-04-19 01:24:47.0
PENANG, MALAYSIA - APRIL 2024 ViTrox, which aims to be the World's Most Trusted Technology Company, is pleased to announce its participation in the NEPCON China 2024 at Booth #1H27 at Shanghai World Expo Exhibition & Convention Center from 24th to 26th April 2024.
Industry News | 2022-03-09 12:40:47.0
The Murray Percival Company is pleased to announce that it now represents Garland Service Company (GSC), a leading provider of custom tooling and machined parts for the PCB industry.
Industry News | 2022-05-18 13:13:02.0
The Murray Percival Company is pleased to announce the sale of an Ersa HR600/2 rework system to L3Harris. The sale was facilitated by Murray Percival Company's Rayne Lythjohan.
Industry News | 2014-06-26 20:12:53.0
Isola Group announced the introduction of Tachyon-100G laminates and prepregs, which enable line cards required to transmit 100 Gigabit Ethernet (100GbE) at data rates in excess of 25 Gb/s per channel. Tachyon-100G has identical electrical properties as its predecessor Tachyon; however, the Z-axis coefficient of thermal expansion (CTE) on Tachyon-100G is more than 30% lower than Tachyon, making it more suitable for fabricating high-layer count, 0.8 mm pitch line cards with heavy 2 oz. copper inner layers.
Industry News | 2002-04-05 08:29:22.0
Detected an Undisclosed Error With Its CDMA2000 1X MSM5100 and MSM5105 Chip Sets and Software
Industry News | 2015-05-07 20:24:57.0
Industry experience and technical expertise enriches Universal’s ability to exceed customer expectations in US southern states.
Industry News | 2019-11-05 22:19:03.0
> News-Blog > Guideline for wire bonding Guideline for wire bonding Tuesday,Jun 12,2018 There are two wire bonding processes that are used, Thermosonic (T/S) Gold Ball Wire Bonding and Ultrasonic (U/S) Aluminum Wedge Wire Bonding. Approximately 90% of all IC Assembly in Semiconductor Packages is manufactured using Gold Ball Bonding process, while Aluminum Wedge Bonding is used to produce about 10% of other Wire Bonding requirements on Printed Circuit Boards (PCB), Printed Circuit Flex (PCF) and other Packages.
Industry News | 2013-06-20 19:31:51.0
Tresky, announces that its wide range of die bonder products from simple and inexpensive to fully automatic are designed to provide simple, precise and reliable solutions for many applications within the microelectronics industry.
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