Industry News | 2003-06-12 08:24:37.0
An adaptive tool prevents small and/or light components "lifting" or "floating" on printed circuit board assemblies during the wave solder process.
Industry News | 2003-02-11 08:42:41.0
To Handle Outbound Logistics Projects for OEMs and to Gain Greater Insight into Their Customers' Requirements for Global Direct-order Fulfillment
Industry News | 2002-03-27 09:42:31.0
Glenn Woodhouse and Janet Semmens were named winners of the Best of Conference Awards
Industry News | 2013-11-05 23:02:54.0
Nordson ASYMTEK will introduce the Spectrum™ II at Productronica this year, marking the 6-year anniversary of the introduction of the Spectrum series of high-speed, high-accuracy dispensing platforms. The Spectrum II S2-900 Series leverages the same small footprint of 600mm x 1321mm as the original Spectrum to provide maximum productivity with minimum manufacturing floor space, but improves the precision, accuracy, and speed of the system to rival much larger platforms.
Industry News | 2021-04-29 17:19:42.0
ASYMTEK Forte™ MAX offers dual jetting with real-time skew correction for faster, enhanced, automated fluid dispensing
Industry News | 2013-08-30 14:08:29.0
Pickering Interfaces will be showcasing their latest hardware solutions at AUTOTESTCON 2013 Chicago.
Industry News | 2014-01-30 17:35:39.0
Manncorp has recently reconfigured and expanded its exclusive selection of SMT turnkey packages, including stencil printers, pick and place machines, and reflow ovens, to accommodate a wider range of production levels and budgets. Among the ten different turnkeys presented on their website at www.manncorp.com/turnkeys is the new 2500-MV package. Priced at only $46,995, the 2500-MV is designed for companies with a limited budget and minimal floor space who need short-run, in-house production capability for ultra-precise, high component-mix SMT assembly.
Industry News | 2020-09-27 20:38:58.0
PENANG MALAYSIA - September 2020 - ViTrox Technologies, an innovative, advanced and cost-effective automated 3D Machine Vision inspection solution provider for the semiconductor and electronics packaging industries, announced its collaboration with Mexico Sales Channel Partner - SMTo Engineering in conducting three Live Spanish Technical Webinars for sharing the latest features and technology of ViTrox's SMT Inspection Solution.
Industry News | 2019-06-30 20:58:59.0
Saki Corporation will present how machine-to-machine (M2M) communication can be achieved by using an automated inspection system based on Quality Driven Production (QDP). The talk will be given at a Technical Workshop in Chonburi, Thailand, sponsored by Saki and Pillarhouse, at the new Saki Asia Pacific Demo Centre, DMG Mori Thailand, on July 3, 2019 from 9:00am-3:00pm. Participants will have the chance to try programming with Saki Self-Programming software and see M2M communication in action. Pillarhouse International Ltd., based in Essex, UK, is a leading force in the selective soldering industry.
Industry News | 2019-11-05 22:19:03.0
> News-Blog > Guideline for wire bonding Guideline for wire bonding Tuesday,Jun 12,2018 There are two wire bonding processes that are used, Thermosonic (T/S) Gold Ball Wire Bonding and Ultrasonic (U/S) Aluminum Wedge Wire Bonding. Approximately 90% of all IC Assembly in Semiconductor Packages is manufactured using Gold Ball Bonding process, while Aluminum Wedge Bonding is used to produce about 10% of other Wire Bonding requirements on Printed Circuit Boards (PCB), Printed Circuit Flex (PCF) and other Packages.
