Industry News | 2020-09-27 20:38:58.0
PENANG MALAYSIA - September 2020 - ViTrox Technologies, an innovative, advanced and cost-effective automated 3D Machine Vision inspection solution provider for the semiconductor and electronics packaging industries, announced its collaboration with Mexico Sales Channel Partner - SMTo Engineering in conducting three Live Spanish Technical Webinars for sharing the latest features and technology of ViTrox's SMT Inspection Solution.
Industry News | 2019-06-30 20:58:59.0
Saki Corporation will present how machine-to-machine (M2M) communication can be achieved by using an automated inspection system based on Quality Driven Production (QDP). The talk will be given at a Technical Workshop in Chonburi, Thailand, sponsored by Saki and Pillarhouse, at the new Saki Asia Pacific Demo Centre, DMG Mori Thailand, on July 3, 2019 from 9:00am-3:00pm. Participants will have the chance to try programming with Saki Self-Programming software and see M2M communication in action. Pillarhouse International Ltd., based in Essex, UK, is a leading force in the selective soldering industry.
Industry News | 2012-08-13 14:31:01.0
Europlacer announces that its 2012 International Sales Meeting, which was held in June, was a resounding success.
Industry News | 2010-04-11 01:47:14.0
APEX, NC - Europlacer announces that it has been awarded an NPI Award in the category of Component Placement-Multi-function for its XPii-II pick-and-place unit. The award was presented to the company during a Tuesday, April 6, 2010 ceremony that took place in the Mandalay Bay Resort & Convention Center in Las Vegas during APEX 2010.
Industry News | 2013-07-26 11:54:04.0
Europlacer announces that existing customer VadaTech Inc. has chosen Europlacer to serve their expansion plans later this year.
Industry News | 2019-11-05 22:19:03.0
> News-Blog > Guideline for wire bonding Guideline for wire bonding Tuesday,Jun 12,2018 There are two wire bonding processes that are used, Thermosonic (T/S) Gold Ball Wire Bonding and Ultrasonic (U/S) Aluminum Wedge Wire Bonding. Approximately 90% of all IC Assembly in Semiconductor Packages is manufactured using Gold Ball Bonding process, while Aluminum Wedge Bonding is used to produce about 10% of other Wire Bonding requirements on Printed Circuit Boards (PCB), Printed Circuit Flex (PCF) and other Packages.
Industry News | 2017-02-23 14:16:37.0
For solder paste inspection (SPI), automatic optical inspection (AOI) and automatic and manual X-ray inspection (AXI/MXI) technologies, DELTEC Automotive GmbH & Co. KG in Furth im Wald, Bavaria, Germany, relies on 3D systems from Viscom AG. Their user-friendly advantages are clearly evident.
Industry News | 2009-12-07 18:40:41.0
Europlacer, a designer and manufacturer of comprehensive SMT placement systems for the global electronics industry, announces that it will debut its XPii modular pick-and-place system in Hall A2, Stand 439 of the upcoming Productronica exhibition, scheduled to take place November 10-13, 2009 at the New Munich Trade Fair Center in Munich, Germany.
Industry News | 2021-03-01 03:53:54.0
PENANG MALAYSIA - February 2021 - ViTrox Technologies, the most trusted Machine Vision inspection solution provider of innovative, advanced, and cost-effective automated Machine Vision inspection solutions for the semiconductor and electronics packaging industries is exhibiting in the virtual IPC APEX EXPO 2021 from March 9th until 11th, 2021.
Industry News | 2007-10-22 16:48:49.0
MORRISVILLE, NC - October 22, 2007 - Juki Corporation, a world-leading provider of automated assembly products and systems, announces that it will introduce its new 350 Selective Soldering System in booth 615 at the upcoming Assembly New England/Nepcon East exhibition and conference scheduled to take place October 30-31, 2007 at the Boston Convention & Exhibit Center.
