Industry News: zevac sac305 solder reflow (Page 1 of 8)

How the modern solder reflow oven works?

Industry News | 2018-10-18 08:36:26.0

How the modern solder reflow oven works?

Flason Electronic Co.,limited

How to Prevent Short Circuits to Ground in QFN Components?

Industry News | 2018-10-18 08:29:16.0

How to Prevent Short Circuits to Ground in QFN Components?

Flason Electronic Co.,limited

SMTA International Technical Committee Announces Best Presentation & Paper Awards from the 2019 Conference

Industry News | 2020-03-19 13:12:42.0

The SMTA is pleased to announce the Best Papers from SMTA International 2019. As speakers at SMTA International, individuals make contributions to the industry by sharing their research and findings. For these exceptional achievements, a cash award and plaque are given to primary authors of all winning papers.

Surface Mount Technology Association (SMTA)

High Thermal Impact Reliability BGA Sphere from SHENMAO

Industry News | 2022-07-16 08:39:50.0

SHENMAO America, Inc. is pleased to announce that the PF918-S Lead-Free BGA Sphere features the newly designed high-reliability alloy PF918 that can achieve tensile strength performance 1.4 times higher than the typical SAC305 alloy.

Shenmao Technology Inc.

New Thermal Fatigue Resistant Lead-free Solder Paste

Industry News | 2021-06-08 03:45:26.0

SHENMAO America, Inc. is pleased to introduce its PF918-P250Thermal Fatigue Resistance Lead-free Solder Paste. The new paste is formulated with the new SHENMAO Sn/4Ag/3Bi Alloy design with high thermal impact reliability.

Shenmao Technology Inc.

SHENMAO Develops Thermal Fatigue Resistant Solder Paste for High-Reliability Requirements

Industry News | 2022-03-14 08:20:37.0

SHENMAO America, Inc. is pleased to introduce its PF918-P250 Thermal Fatigue Resistance Lead-free Solder Paste. The new paste is formulated with the new SHENMAO Sn/4Ag/3Bi Alloy, which is designed with high thermal impact reliability for long service life electronic products with high-reliability requirements.

Shenmao Technology Inc.

SHENMAO Shows High-Rel Solder Paste at SMTA Guadalajara

Industry News | 2022-08-26 09:15:23.0

SHENMAO America, Inc. will exhibit at the SMTA Guadalajara Expo & Tech Forum, scheduled to take place Sept. 21-22, 2022, at the Expo Guadalajara in Jalisco, Mexico. The company will showcase its PF918-P250 Thermal Fatigue Resistance Lead-free Solder Paste. The new paste can increase thermal reliability performance by a minimum of 30 percent.

Shenmao Technology Inc.

Christopher Associates Debuts S3X-BF70M and 200N Series Wafer Bumping Pastes

Industry News | 2010-12-01 15:42:43.0

Christopher Associates introduces the S3X-BF70M and 200N series wafer bumping pastes. The pastes exhibit a high definition over time and at elevated temperatures.

Christopher Associates Inc.

SHENMAO to Exhibit New Solder Pastes with NeVo at productronica

Industry News | 2021-10-11 16:08:26.0

SHENMAO America, Inc. today announced plans to exhibit together with NeVo GmbH at productronica 2021, scheduled to take place Nov. 16-19, 2021 at Neue Messe München in Munich, Germany. NeVo will showcase Shenmao's PF918-P250 Thermal Fatigue Resistance Lead-free Solder Paste and PF606-P245X Lead-Free Solder Paste.

Shenmao Technology Inc.

What's happening at Nihon Superior in 2008?

Industry News | 2008-03-25 23:59:52.0

Comment from Tetsuro Nishimura, North American Sales Manager

Nihon Superior Co., Ltd.

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