Industry News | 2011-09-06 15:20:36.0
SMTA China announced the Best Paper/Presentation and Best Exhibit Awards at its annual awards presentation held in conjunction with SMTA China and Hong Kong Chapter Breakfast Reception, which took place August 31, 2011 at the Ritz-Carlton Hotel in Shenzhen.
Industry News | 2009-09-17 17:02:12.0
EAST HANOVER, NJ – Zymet has introduced a new reworkable underfill encapsulant, CN-1728, designed to underfill Package-on-Package (POP) assemblies. Underfilled POP’s have greater difficulty in passing thermal cycle tests than underfilled BGA’s. Compared to earlier generation underfills, CN-1728 has a lower coefficient of thermal expansion and higher Tg, and better compatibility with flux residues, both of which contribute to its superior thermal cycle performance.
Industry News | 2012-01-13 13:20:53.0
Zymet has introduced a new reworkable underfill encapsulant, CN-1736, designed to underfill 0.4-mm pitch Package-on-Package (POP) assemblies. It has low viscosity and a lower CTE than its predecessors. Plus it has greater flux compatibility, making it suitable for use with a broader range of solderpastes and tacky fluxes.
Industry News | 2011-04-07 20:23:54.0
Zymet Inc. has introduced a reworkable edgebond adhesive, UA-2605, that improves thermal cycle performance of CBGAs and plastic BGAs. In one trial, UA-2605 tripled the 0°C to +100°C performance of a CBGA, to nearly 2500 cycles. Previously, an underfill was needed to achieve this level of performance.
Industry News | 2010-03-17 18:31:55.0
EAST HANOVER, NJ – Zymet has introduced a new silica-filled reworkable board-level underfill encapsulant, X2825, whose coefficient of thermal expansion, CTE, is 26 ppm/°C. The underfill enhances drop and shock test reliability and, compared to higher CTE underfills, provides superior thermal cycle performance.
Industry News | 2013-02-08 23:26:44.0
Zymet has introduced a new reworkable underfill encapsulant, CN-1751-4, that is extraordinarily crack resistant, to withstand flexing experienced by flexible printed circuitry or drops and shocks of very thin printed circuit assemblies.
Industry News | 2004-04-27 15:19:57.0
Zymet has introduced a new reworkable underfill encapsulant, CN-1453, designed for BGA encapsulation. Removal of defective BGA's is easily accomplished by heating the component and the underfill encapsulant to 220°C. Underfill encapsulant residues are easily scraped or brushed off.
Industry News | 2003-09-25 13:32:47.0
Reduce waste and cost.
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