948 .3 mm bga results

SMT Express, Volume 4, Issue No. 12 - from SMTnet.com

SMTnet Express - February 21, 2019

SMTnet Express - March 1, 2018

Drop Impact Reliability of Edge-bonded Lead-free Chipscale Packages

Drop Impact Reliability of Edge-bonded Lead-free Chipscale Packages Drop Impact Reliability of Edge-bonded Lead-free Chipscale Packages This paper presents the drop test reliability results for edge-bonded 0.5mm pitch lead-free chip scale

Effects of an Appropriate PCB Layout and Soldering Nozzle Design on Quality and Cost Structure in Selective Soldering Processes

SMTnet Express - April 7, 2022

3D IC Development Needs Innovative Socket Solution

3D IC Development Needs Innovative Socket Solution 3D IC Development Needs Innovative Socket Solution Evolution from cell phones with only a base-band processor and limited memory to today's high-end phones with an additional applications

De-fluxing Eases "Sticky Situations"

SMT Express, Issue No. 1 - from SMTnet.com

SMT Express, Issue No. 1 - from SMTnet.com Volume 1, Issue No. 1 Thursday, June 3, 1999 Tricks of the Trade Optimizing Time/Pressure Dispensing ofAdhesives by Chrys Shea                           Return to Previous Page Over the past

SMTnet Express - January 26, 2017