232 .4mm pitch connectors results

SMT Express, Volume 2, Issue No. 3 - from SMTnet.com

SMT Express, Volume 2, Issue No. 3 - from SMTnet.com Volume 2, Issue No. 3 Thursday, March 16, 2000 Featured Article Return to Front Page Curtailing Voids in Fine Pitch Ball Grid Array Solder Joints by Gary Morrison and Kevin Lyne

Lead-free and Tin-lead Assembly and Reliability of Fine-pitch Wafer-Level CSPs

Lead-free and Tin-lead Assembly and Reliability of Fine-pitch Wafer-Level CSPs News • Forums • SMT Equipment • Company Directory • Calendar • Career Center • Advertising • About • FREE Company Listing! Lead-free and Tin-lead Assembly

SMT Express, Volume 3, Issue No. 1 - from SMTnet.com

Improve Margins By Reducing Rework - A Benchmark Comparison

A Novel Local Search Integer-Programming-Based Heuristic for PCB Assembly on Collect-and-Place Machines

Using Flexible Circuits as an Electronic Interconnection... Do's and Don'ts

New Methods of Testing PCB Traces Capacity and Fusing

The Surface Finish Effect on the Creep Corrosion in PCB

Application Of Build-in Self Test In Functional Test Of DSL

SMT Manufacturability and Reliability in PCB Cavities